Intel CHIPSET 820E - Manual (Page 65)

Intel ® 820E Chipset
R
Design Guide 65
2.8.5. AGP Clock Routing
The maximum total AGP clock skew (between the MCH and the graphics component) is 1 ns for all data
transfer modes. This 1 ns includes skew and jitter that originates on the motherboard, add-in card, and
clock synthesizer. Clock skew must be evaluated not only at a single threshold voltage, but at all points
on the clock edge that fall within the switching range. The 1-ns skew budget is divided such that the
motherboard is allotted 0.9 ns of clock skew. (The motherboard designer determines how the 0.9 ns are
allocated between the board and the synthesizer.) For the Intel 820E chipset platform’s AGP clock
routing guidelines, refer to Chapter 4 Clocking.
2.8.6. General AGP Routing Guidelines
The following routing guidelines are recommended for the optimal system design. The main focus of
these guidelines is the minimization of signal integrity problems on the AGP interface of the Intel 820E
chipset’s MCH. The following guidelines are not intended to replace thorough system validation on Intel
820E chipset-based products.
2.8.6.1. Recommendations
Decoupling
• For V
DDQ
decoupling, at least six 0.01- µ F capacitors are required, of which at least four must be
within 70 mils of the outer row of balls on the MCH. (See Figure 37.)
• Evenly distribute the placement of decoupling capacitors in the AGP interface signal field.
• Use a low-ESL ceramic capacitor (e.g., 0603 body type, X7R dielectric).
• In addition to the minimum decoupling capacitors, bypass capacitors should be placed at vias that
transition AGP signals from one reference signal plane to another. In a typical four-layer PCB
design, the signals transition from one side of the board to the other.
• One extra 0.01- µ F capacitor is required per 10 vias. The capacitor should be placed as close as
possible to the center of the via field.
• Ensure that the AGP connector is well decoupled, as described in the AGP Design Guide, Revision
1.0 (Section 1.5.3.3).
Note: To add the decoupling capacitors as close as possible to the MCH and/or close to the vias, the trace
spacing may be reduced as the traces go around each capacitor. The narrowing of the space between
traces should be minimal and for as short a distance as possible (1 inch max.).