Cirrus Logic CS42L73 - Manual (Page 135)

DS882F1 135
CS42L73
10.PACKAGE DIMENSIONS
10.1 WLCSP Package
64-Ball WLCSP (3.44 x 3.44 mm Body) Package Drawing
Table 17. WLCSP Package Dimensions
Dimension
Millimeters
A 0.450 0.505 0.560
A1 0.170 0.200 0.230
A2 0.280 0.305 0.330
M BSC 2.800 BSC
N BSC 2.800 BSC
b 0.230 0.260 0.290
c REF 0.320 REF
d REF 0.320 REF
e BSC 0.400 BSC
X 3.415 3.440 3.465
Y 3.415 3.440 3.465
ccc = 0.05
ddd = 0.15
Note: Controlling dimension is millimeters.
e
A2
Ball A1
Location
Indicator
X
Y
BUMP SIDE SIDE VIEW
A1
b
N
M
d
c
WAFER BACK SIDE
Location Indicator
(Seen Through Package)
Ball A1
A
e Seating plane
X
Z
Y
Notes:
• Dimensioning and tolerances per ASME Y 14.5M–1994.
• The Ball A1 position indicator is for illustration purposes only and may not be to scale.
• Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body and the seating
plane Datum Z.
øb
Øddd Z X Y
Øccc Z