Document Outline

• Cover Page
• Title Page
• Trademarks
• Disclaimer
• Copyright
• Declaration Of Conformity
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Introduction
    • 1.1.1 Related Manuals
  • 1.2 Instrument Safety
    • 1.2.1 Definition of Notes, Cautions and Warnings
    • 1.2.2 General Safety Information
    • 1.2.3 Earth Ground
  • 1.3 How To Contact INFICON
    • 1.3.1 Returning STM-2XM
  • 1.4 Specifications
    • 1.4.1 Measurement
    • 1.4.2 Film Parameters
    • 1.4.3 System Parameters
    • 1.4.4 Digital I/O
    • 1.4.5 Power
    • 1.4.6 Operating Environment
    • 1.4.7 Size and Weight
  • 1.5 Unpacking and Inspection
  • 1.6 Parts and Options Overview
    • 1.6.1 Base Configurations
    • 1.6.2 Accessories
    • 1.6.3 Sensors
• Chapter 2 Installation
  • 2.1 Installation Requirements
    • 2.1.1 Parts Requirements
    • 2.1.2 Ground Requirements
    • 2.1.3 Connection to Earth Ground
  • 2.2 Rear Panel
    • 2.2.1 Sensors
    • 2.2.2 Relay Outputs
    • 2.2.3 Analog Outputs
    • 2.2.4 Remote Inputs
  • 2.3 Basic Vacuum System Components
  • 2.4 Deposition System Installation
    • 2.4.1 Sensor Head Installation
• Chapter 3 Operation
  • 3.1 Front Panel Description
    • 3.1.1 System Control Buttons
    • 3.1.2 Data Entry and Programming Buttons
    • 3.1.3 Changing a Parameter
    • 3.1.4 Runtime Screen
  • 3.2 Programming
    • 3.2.1 Main Menu
      • 3.2.1.1 Edit Film
      • 3.2.1.2 System Settings
      • 3.2.1.3 Setup Parameters
  • 3.3 STM-2XM Operating Modes
    • 3.3.1 Simple
    • 3.3.2 Backup
    • 3.3.3 Averaging
    • 3.3.4 Alloy
    • 3.3.5 Independent
  • 3.4 Operation
    • 3.4.1 No Shutter Delay
    • 3.4.2 Shutter Delay
    • 3.4.3 Test Mode
    • 3.4.4 Rate Sampling
  • 3.5 Film States
• Chapter 4 Software
  • 4.1 Introduction
  • 4.2 Installing INFICON STM-2XM FilmMaker Software
    • 4.2.1 Installing the Protocol Server
    • 4.2.2 Installing INFICON STM-2XM FilmMaker Software
    • 4.2.3 Starting INFICON STM-2XM FilmMaker Software
      • 4.2.3.1 Starting the Software in Windows XP or Windows 7
      • 4.2.3.2 Starting the Software in Windows 8
  • 4.3 STM-2XM Parameter Manager
    • 4.3.1 Main Tab
      • 4.3.1.1 Main Setup Pane
      • 4.3.1.2 Utilities Pane
    • 4.3.2 Films Tab
    • 4.3.3 System Tab
      • 4.3.3.1 Setup parameters Pane
      • 4.3.3.2 System parameters Pane
    • 4.3.4 Save/Load file Tab
    • 4.3.5 Save/Load instrument Tab
    • 4.3.6 About Tab
• Chapter 5 Communications
  • 5.1 Introduction
  • 5.2 Communications Connections
    • 5.2.1 RS-232/RS-485 Connector
    • 5.2.2 RS-232 Point-to-Point Mode
    • 5.2.3 RS-485 TTL Differential Signaling Mode
  • 5.3 Electrical
    • 5.3.1 RS-485 Line Signal
    • 5.3.2 Bit Time
  • 5.4 Bauds
  • 5.5 Message Format
    • 5.5.1 Sycon Protocol
      • 5.5.1.1 Command Format
    • 5.5.2 Sycon Multi-Drop Protocol (SMDP)
      • 5.5.2.1 Command Format
        • 5.5.2.1.1 Checksum
        • 5.5.2.1.2 Command Packet Format
        • 5.5.2.1.3 Response Packet Format
    • 5.5.3 Optional Serial Command Mode
      • 5.5.3.1 Optional Serial Command Format
      • 5.5.3.2 Additional Option to Serial Command
  • 5.6 Communication Library
    • 5.6.1 Methods
    • 5.6.2 Communication Properties
    • 5.6.3 Other Properties
  • 5.7 Windows/SMDP Server Implementation
  • 5.8 Communications Commands
    • 5.8.1 Command: ?
    • 5.8.2 Command: @
    • 5.8.3 Command: C
    • 5.8.4 Command: E/F
      • 5.8.4.1 Analog Output Function
      • 5.8.4.2 Relay Functions
      • 5.8.4.3 Input Functions
    • 5.8.5 Command: G/H
    • 5.8.6 Command: I/J
    • 5.8.7 Command: K/L
    • 5.8.8 Command: M/N
    • 5.8.9 Command: O
    • 5.8.10 Command: P
      • 5.8.10.1 Alloy State Class
    • 5.8.11 Command: Q
      • 5.8.11.1 Raw Status
      • 5.8.11.2 Raw Status 2
      • 5.8.11.3 Film State
    • 5.8.12 Run Screen Lock Codes and Functions
    • 5.8.13 Command Examples
      • 5.8.13.1 Query Software Version
      • 5.8.13.2 Reboot SMDP Device
• Chapter 6 Troubleshooting
  • 6.1 Troubleshooting Guide
  • 6.2 Maintenance
  • 6.3 Spare Parts
  • 6.4 Persistent Crystal Fail Indication
  • 6.5 Diagnostics Menu
• Chapter 7 Calibration Procedures
  • 7.1 Importance of Density, Tooling and Z-Ratio
  • 7.2 Determining Density
  • 7.3 Determining Tooling
  • 7.4 Laboratory Determination of Z-Ratio
• Chapter 8 Measurement and Theory
  • 8.1 Basics
    • 8.1.1 Monitor Crystals
    • 8.1.2 Period Measurement Technique
    • 8.1.3 Z-match Technique
• Appendix A Material Table
  • A.1 Introduction