Rockwell Automation 2093-xxxx Kinetix 2000 Multi-axis Servo Drive User Manual - Manual (Page 26)

Publication 2093-UM001A-EN-P — March 2007
26 Planning the Kinetix 2000 Drive System Installation
Minimizing Electrical
Noise This section outlines best practices which minimize the possibility of
noise-related failures as they apply specifically to Kinetix 2000 system
installations.
For more information on the concept of high-frequency (HF) bonding, the
ground plane principle, and electrical noise reduction, refer to the System
Design for Control of Electrical Noise Reference Manual, publication
GMC-RM001.
Bonding Modules
Bonding is the practice of connecting metal chassis, assemblies, frames,
shields, and enclosures to reduce the effects of electromagnetic interference
(EMI).
Unless specified, most paints are not conductive and act as insulators. To
achieve a good bond between power rail and the subpanel, surfaces need to be
paint-free or plated. Bonding metal surfaces creates a low-impedance return
path for high-frequency energy.
Improper bonding blocks the direct return path and results in high-frequency
energy traveling elsewhere in the cabinet. Excessive high-frequency energy can
effect the operation of other microprocessor controlled equipment.
The illustrations that follow show details of recommended bonding practices
for painted panels, enclosures, and mounting brackets.
IMPORTANT
To improve the bond between the power rail and subpanel, construct
your subpanel out of zinc plated (paint-free) steel.