INFICON SQC-310 Thin Film Deposition Controller - Manual (Page 26)

Chapter 2 Operation
2-7
2.4 Defining a Layer
To edit a Process Layer, press Process Menu. Select the desired process, then press
Edit. Finally, select the desired layer and press Edit.
F n l T h k
T h ic k n e s s L im it
S t a r t M o d e
O u t p u t
M a x . P o w e r 9 0 . 0
O u t 1
M a n u a l
0 . 0 0 0
0 . 1 0 0
O u t 1 / O u t 2
A u t o / M a n .
k A
k / A
L a y e r E d i t M e n u
T o
M a i n
P r e v
M e n u
E d i t
P r o c e s s 1 - > L a y e r 1 - > F ilm 1
P a r a m e t e r V a lu e U n it s
I n it R a t e 1 0 . 0 A / s
T im e S e t p o in t 0 : 0 0 : 0 0 h : m m : s s
%
O f f
O n
O f f
D is a b le d
S e n s o r 2
S e n s o r 4
S e n s o r 3
R a m p 1
S le w R a t e
S e n s o r 1
O f f
9 0 . 0
O n / O f f
O n / O f f
E n / D is
O n / O f f
O n / O f f
%
Initial Rate and Final Thickness are the main process setpoints for the film used in this
layer. Time Setpoint and Thickness Limit are secondary values that will activate a relay
when they are reached.
Start Mode controls operation in multi layer processes. In Auto Start the layer starts
immediately on completion of the previous layer. Manual Start waits for a user signal
via the front panel, digital input, or communications port to start the layer. Don’t confuse
this Manual Start mode with the Manual Power SoftKey function.
The Output entry assigns the layer/film parameters to a specific SQC-300 rear panel
output. The layer and film parameters for power, preconditioning, PID settings, etc. will
be applied to the selected output. Assign the Max Power and Slew Rate appropriate for
this material and your power supply. For now, set both to 100%. Set them to lower
values if you find that small power changes cause excessively large changes in
deposition rate.
The SQC-300 can use multiple sensors to measure a film’s deposition rate and
thickness. If multiple sensors are selected, an average of the sensors is used. Set
each sensor that will be used to measure this film to ON.
Rate Ramps allow the PID controlled deposition rate to change over time, under PID
control. Each rate ramp has a starting thickness, an elapsed time to ramp to the new
rate, and a new rate setpoint. Each process layer can have up to two rate ramps.