INFICON MDC-360C Thin Film Deposition Controller - Manual (Page 14)

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7.4 DISCRETE INPUTS ...................................................................................................... 7-1
7.5 DIGITAL-TO-ANALOG CONVERTER OUTPUTS .................................................... 7-2
7.6 DIGITAL-TO-ANALOG CONVERTER CONTROL INPUTS .................................... 7-2
8. CONTROLLER INSTALLATION ................................................................................. 8-1
8.1 MOUNTING .................................................................................................................. 8-1
8.2 PROPER GROUNDING ................................................................................................ 8-1
8.3 EXTERNAL CONNECTIONS ...................................................................................... 8-1
8.3.1 POWER...................................................................................................................... 8-1
8.3.2 LINE VOLTAGE SELECTION AND FUSE REPLACEMENT .................................. 8-2
8.3.3 GROUND LUG.......................................................................................................... 8-2
8.3.4 REMOTE POWER HANDSET................................................................................... 8-3
8.3.5 SOURCE-SENSOR .................................................................................................... 8-3
8.3.6 RS-232 COMMUNICATION...................................................................................... 8-3
8.3.7 DISCRETE INPUT/OUTPUT .................................................................................... 8-3
8.3.8 DIGITAL-TO-ANALOG CONVERTER (DAC) .......................................................... 8-4
8.4 P OWER S WITCH ............................................................................................................... 8-4
8.5 CONTROLLER COVER REMOVAL ........................................................................... 8-4
9. SYSTEM INSTALLATION ............................................................................................. 9-1
9.1 SENSOR HEAD DESCRIPTION .................................................................................. 9-1
9.2 SENSOR HEAD INSTALLATION ............................................................................... 9-1
9.3 SENSOR OSCILLATOR ............................................................................................... 9-2
9.3.1 INSTALLATION......................................................................................................... 9-2
9.4 INSTRUMENTATION FEEDTHROUGH .................................................................... 9-2
9.5 SENSOR CRYSTAL REPLACEMENT ........................................................................ 9-2
9.5.1 CRYSTAL CARE AND HANDLING........................................................................... 9-3
9.5.2 CRYSTAL REPLACEMENT PROCEDURE .............................................................. 9-3
9.6 TYPICAL SYSTEM INSTALLATION ......................................................................... 9-5
10. THEORY OF OPERATION ......................................................................................10-1
10.1 BASIC MEASUREMENT ............................................................................................10-1
10.2 FILM THICKNESS CALCULATION ..........................................................................10-1
10.3 CRYSTAL HEALTH CALCULATION .......................................................................10-3
10.4 RATE CALCULATION................................................................................................10-3
10.5 M ULTI - SENSOR AVERAGING ...........................................................................................10-4
10.6 EMPIRICAL CALIBRATION ......................................................................................10-5
10.6.1 FILM DENSITY....................................................................................................10-5
10.6.2 TOOLING FACTOR.............................................................................................10-5
10.6.3 ACOUSTIC IMPEDANCE ...................................................................................10-6
11. COMPUTER INTERFACE........................................................................................11-1
11.1 GENERAL.....................................................................................................................11-1
11.2 RS-232 SERIAL INTERFACE......................................................................................11-1
11.3 RS-485 SERIAL INTERFACE......................................................................................11-1
11.4 IEEE-488 PARALLEL INTERFACE............................................................................11-2
11.5 PROTOCOL ..................................................................................................................11-2
11.6 DATA TYPES ...............................................................................................................11-3
11.7 MESSAGE RECEIVED STATUS ................................................................................11-3
11.8 INSTRUCTION SUMMARY .......................................................................................11-4
11.9 INSTRUCTION DESCRIPTIONS................................................................................11-5
12. REPAIR AND MAINTENANCE...............................................................................12-1
12.1 HANDLING PRECAUTIONS ......................................................................................12-1
12.2 MAINTENANCE PHILOSOPHY.................................................................................12-1
12.3 TROUBLE SHOOTING AIDS......................................................................................12-2
12.4 RETURNING THE MDC-360C TO THE FACTORY ..................................................12-3