Xtal fail switch, Xtal mrgn switch, Rate dev. atten – INFICON MDC-360C Thin Film Deposition Controller User Manual

Page 96: Maximum power, Minimum power, Change pocket, Change crystal, Attention action, Calibration done, Xtal fail switch -12

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MDC-360C DEPOSITION CONTROLLER

OPERATING THE MDC-360C

5-12

5.10.1.19

XTAL FAIL SWITCH

This message indicates the primary crystal has failed and the sensor input has
been switched to the backup crystal. In addition, the Attention warning sounds.
Press any key to clear the sound.

5.10.1.20

XTAL MRGN SWITCH

This message indicates the primary crystal is marginal and the sensor input has
been switched to the backup crystal. In addition, the Attention warning sounds.
Press any key to clear the sound.

5.10.1.21 RATE

DEV.

ATTEN

The deposition rate deviation error is greater than the value set in the Rate
Deviation Attention parameter.

5.10.1.22 MAXIMUM

POWER

The output power is being limited by the value set in the Maximum Power
parameter.

5.10.1.23 MINIMUM

POWER

The output power is at or below the minimum power set by the Minimum Power
parameter.

5.10.1.24 CHANGE

POCKET...

Prompts the operator to switch the source pocket to the correct position. The
process will be on hold until the Start key is pressed. There is no message if the
Control parameter is set to Auto (Source Setup Menu).

5.10.1.25 CHANGE

CRYSTAL...

Prompts the operator to switch the sensor to the correct crystal position. The
process will be on hold until the Start key is pressed. There is no message if the
Control parameter is set to Auto (Sensor Setup Menu).

5.10.1.26 ATTENTION

ACTION

This message indicates the Alert sound was initiated by an internal action.

5.10.1.27 CALIBRATION

DONE

This message indicates that the sensor tooling factor calibration run initiated by
the user is now complete. The next step is to measure the substrate's actual
thickness using another measuring device such as a profilometer and entered the
measured thickness. The MDC-360C will calculate the tooling factors for all
sensors enabled during calibration based on the each sensor's thickness and the
measure substrate thickness.

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