ProSoft Technology MVI69-PDPMV1 - Manual (Page 211)

MVI69-PDPMV1 ♦ CompactLogix or MicroLogix Platform Reference
PROFIBUS DPV1 Master User Manual
ProSoft Technology, Inc. Page 211 of 225
July 8, 2011
This example indicates the system components and devices in a system with
equipotential bonding.
Grounding and Shielding for Systems without Equipotential Bonding
Note: Grounding and shielding is to be carried out the same as for systems with equipotential
bonding.
If this is not possible because of system or construction specific reasons
however, use distributed ground with a capacitive coupling of high frequency
interference signals.
This representation shows distributed grounding with capacitive coupling.