G.bond, 1 bonding overview, 1 cell-level bonding process – ZyXEL Communications IES-708-22A User Manual

Page 135: 2 bonding standards, 2 g.bond setup screen, Chapter 16 g.bond, G.bond (135)

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IES-708-22A User’s Guide

135

C

H A P T E R

16

G.bond

This chapter explains how to combine multiple ports into a logical link.

16.1 Bonding Overview

Bonding combines multiple ports into a logical link. This lets the IES-708-22A transmit at
higher bandwidths over longer distances. In addition, bonding is a cheaper alternative than
installing fiber.
Bonding can occur at the physical level or at the cell/packet level. The IES-708-22A can bond
ports at the ATM-cell level.

16.1.1 Cell-level Bonding Process

This process depends on an 8-bit or 12-bit sequence ID (SID). If the SID is eight bits, it uses
the first eight bits of the VCI field. If the SID is twelve bits, it uses the GFC field and the first
eight bits of the VCI field.
This process consists of these steps.

1 The sender breaks up the message into several segments and assigns a sequence ID to

each segment.

2 Each segment is transmitted over one of the ports in the bond.
3 The receiver uses the sequence ID to reconstruct the original message.

16.1.2 Bonding Standards

ITU G.998.1 defines bonding standards for ATM networks.

16.2 G.bond Setup Screen

Use this screen to bond one or more ports into a logical link.
To open this screen, click Basic Setting > G.bond.

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