Document Outline

• Cover Page
• Title Page
• Trademarks
• Disclaimer
• Copyright
• Declaration Of Conformity
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Introduction
  • 1.2 Cygnus 2 Safety
    • 1.2.1 Definition of Notes, Cautions and Warnings
    • 1.2.2 General Safety Information
    • 1.2.3 Earth Ground
    • 1.2.4 Main Power Connection
  • 1.3 How To Contact INFICON
    • 1.3.1 Returning Your Cygnus 2
  • 1.4 Cygnus 2 Specifications
    • 1.4.1 Measurement
    • 1.4.2 Screens and Hierarchy
    • 1.4.3 Cygnus 2 Features
      • 1.4.3.1 Recipe Storage & Datalogging
      • 1.4.3.2 Sensor Parameters
      • 1.4.3.3 Source Parameters
      • 1.4.3.4 Material Parameters
      • 1.4.3.5 General Global Parameters
    • 1.4.4 ‘Display
    • 1.4.5 DAC Outputs
    • 1.4.6 Logic Processing
    • 1.4.7 Relays / Inputs
    • 1.4.8 Remote Communications
    • 1.4.9 Accessories
    • 1.4.10 Power
    • 1.4.11 Operating Environment
    • 1.4.12 Storage Temperature
    • 1.4.13 Warm Up Period
    • 1.4.14 Size
    • 1.4.15 Installation Clearance Requirements
      • 1.4.15.1 Connector Clearances:
      • 1.4.15.2 Cooling Clearances:
    • 1.4.16 Weight
    • 1.4.17 Cleaning
  • 1.5 Unpacking and Inspection
  • 1.6 Parts and Options Overview
    • 1.6.1 Base Configurations
    • 1.6.2 Pre-installed Options or Spares
    • 1.6.3 Optional Accessories
    • 1.6.4 Oscillator Packages
    • 1.6.5 Sensors
    • 1.6.6 Replacement Cables
  • 1.7 Initial Power-On Verification
• Chapter 2 Installation and Interfaces
  • 2.1 Location Guidelines
    • 2.1.1 Sensor Types
    • 2.1.2 Sensor Installation
    • 2.1.3 Cygnus 2 Installation
  • 2.2 Avoiding Electrical Interference
    • 2.2.1 Verifying/Establishing Earth Ground
    • 2.2.2 Connections to Earth Ground
    • 2.2.3 Minimizing Noise Pickup From External Cabling
  • 2.3 Connecting the Controller
    • 2.3.1 Routing XIU Cables
    • 2.3.2 Interface Cable Fabrication and Pin-Out
      • 2.3.2.1 Source Control Connection
      • 2.3.2.2 Crucible Indexer Connections
      • 2.3.2.3 DAC Option Kit
      • 2.3.2.4 I/O Expansion Options
      • 2.3.2.5 RS-232C Communications
      • 2.3.2.6 Isolated +24 V (dc) Supply
• Chapter 3 Operation
  • 3.1 Front Panel Controls
  • 3.2 Rear Panel Interfaces
  • 3.3 Displays
    • 3.3.1 Main Menu Display
    • 3.3.2 Operate
    • 3.3.3 Sensor Information
      • 3.3.3.1 Sensor Information Rate/Xtal Display Description
      • 3.3.3.2 Crystal Life and Starting Frequency
      • 3.3.3.3 Function Key Selection Choices
      • 3.3.3.4 Sensor Information Type/Freq Display Description
        • 3.3.3.4.1 TEST XIU
    • 3.3.4 Sensor Screen
    • 3.3.5 Source
    • 3.3.6 Material
      • 3.3.6.1 Overview Page
      • 3.3.6.2 Source Page
      • 3.3.6.3 Sensor Page
      • 3.3.6.4 Pre/Post Page
      • 3.3.6.5 Deposit Page
      • 3.3.6.6 Lib A-Hf, Lib Hf-Sc, Lib Sc-Z Sub-Displays
    • 3.3.7 General
      • 3.3.7.1 Process Page
      • 3.3.7.2 DACs Page
      • 3.3.7.3 Comm Page
      • 3.3.7.4 Message Page
      • 3.3.7.5 Date/Time Page
      • 3.3.7.6 Test Page
      • 3.3.7.7 Lock Page
      • 3.3.7.8 Audio/Visual Page
    • 3.3.8 Digital I/O
    • 3.3.9 Logic
    • 3.3.10 Maintenance
    • 3.3.11 Counter / Timer
    • 3.3.12 USB Storage
    • 3.3.13 Programming Guidelines
  • 3.4 State Descriptions
  • 3.5 Special Features
    • 3.5.1 Crystal Switching
      • 3.5.1.1 XtalTwo (CrystalTwo)
      • 3.5.1.2 XtalSix (CrystalSix)
      • 3.5.1.3 Xtal12 (Crystal12)
      • 3.5.1.4 Generic Sensor Crystal Switching
    • 3.5.2 Source/Crucible Selection
      • 3.5.2.1 Example: Programming Turret Source Crucible Selection
    • 3.5.3 Auto-Z
    • 3.5.4 Rate Watcher
    • 3.5.5 Handheld Controller
      • 3.5.5.1 Determining Soak Power with the Handheld Controller
    • 3.5.6 Test Mode
      • 3.5.6.1 Standard or Time Compressed
      • 3.5.6.2 Advanced Test
    • 3.5.7 USB Storage Device
    • 3.5.8 Lock and Access Codes
    • 3.5.9 Datalog
      • 3.5.9.1 Datalog contents:
      • 3.5.9.2 Page Format ASCII Example:
      • 3.5.9.3 Comma Format ASCII Example to USB Storage Device:
    • 3.5.10 DAC Monitoring
    • 3.5.11 Trend Analysis
      • 3.5.11.1 Cygnus 2 Parameters Associated with the Trend Analysis Feature
• Chapter 4 Sensor & Source Set-Up
  • 4.1 Sensor Set-Up Introduction
    • 4.1.1 Sensor Display Navigation
    • 4.1.2 Sensor Parameters
  • 4.2 Source Set-Up Introduction
    • 4.2.1 Source Navigation
    • 4.2.2 Source Parameters
  • 4.3 DAC Output Selection Rules
• Chapter 5 Material Set-Up
  • 5.1 Introduction
    • 5.1.1 Material Overview Page
    • 5.1.2 Material Definition
    • 5.1.3 Material Source Page Parameters
    • 5.1.4 Material Sensor Parameters Page
    • 5.1.5 Pre/Post Screen Deposit Page Parameters
    • 5.1.6 Post Deposit Parameters
    • 5.1.7 Deposit Page Parameters
  • 5.2 Special Material Parameter Features
    • 5.2.1 Skip Deposit
    • 5.2.2 RateWatcher™ Sample and Hold Feature
• Chapter 6 General Parameters
  • 6.1 General Set-Up Overview
  • 6.2 General Process Page
  • 6.3 DACs Page Parameters
  • 6.4 COMM Page Parameters
  • 6.5 MESSAGE Page Set-up
  • 6.6 DATE / TIME Set Up
  • 6.7 TEST Page Set Up
  • 6.8 LOCK Page Code Set-up
  • 6.9 AUDIO / VISUAL Page Set Up
• Chapter 7 Digital I/O
  • 7.1 Digital I/O Screen
  • 7.2 All Input Page
  • 7.3 All Output Page
  • 7.4 I/O Board Page
    • 7.4.1 Output Type
• Chapter 8 Logic Statement Set-Up
  • 8.1 Logic Statement Overview
  • 8.2 Editing the Logic Statements
    • 8.2.1 Logic Statement Groups
    • 8.2.2 Logic Statement Editing
    • 8.2.3 AND/OR and ON Logic Connectors
      • 8.2.3.1 ON Operator
  • 8.3 IF Event Definitions
  • 8.4 THEN Action Definitions
  • 8.5 Logic Statement Example
• Chapter 9 Remote Communications
  • 9.1 Remote Communication Configuration Overview
  • 9.2 Physical Connections
    • 9.2.1 RS-232C Serial Port
    • 9.2.2 TCP/IP Ethernet Port
      • 9.2.2.1 Network Connection
      • 9.2.2.2 How to Set Up the Network Protocol on the PC
  • 9.3 Message Format
    • 9.3.1 Protocol
      • 9.3.1.1 Command Packet (Host to Cygnus 2 Message)
      • 9.3.1.2 Data Type Codes
      • 9.3.1.3 Response Packet (Cygnus 2 to Host Message)
      • 9.3.1.4 Timeouts
  • 9.4 Communication Commands
    • 9.4.1 Query and Update Commands
    • 9.4.2 Status Commands
    • 9.4.3 HELLO Command
    • 9.4.4 Query General Parameter
    • 9.4.5 Update General Parameter
    • 9.4.6 Query Material Parameter
    • 9.4.7 Update Material Parameter
    • 9.4.8 Query Sensor Parameter
    • 9.4.9 Update Sensor Parameter
    • 9.4.10 Query Source Parameter
    • 9.4.11 Update Source Parameter
    • 9.4.12 Query Process Material Parameter
    • 9.4.13 Update Process Material Parameter
    • 9.4.14 Query Material Name
    • 9.4.15 Update Material Name
    • 9.4.16 Query Input Name
    • 9.4.17 Update Input Name
    • 9.4.18 Query Output Name
    • 9.4.19 Update Output Name
    • 9.4.20 Query Output Type
    • 9.4.21 Update Output Type
    • 9.4.22 Query User Message
    • 9.4.23 Update User Message
    • 9.4.24 Query Logic Statement
    • 9.4.25 Update Logic Statement
    • 9.4.26 Cygnus 2 Event List
    • 9.4.27 Cygnus 2 Action List
    • 9.4.28 Status General
    • 9.4.29 Status Material
    • 9.4.30 Status Sensor
    • 9.4.31 Remote General Action
    • 9.4.32 Remote Material Action
    • 9.4.33 Cygnus 2 Communications Examples
      • 9.4.33.1 General Command Packet Format
      • 9.4.33.2 General Response Packet Format
      • 9.4.33.3 HELLO Command, ASCII name and version
      • 9.4.33.4 Query Material Parameter, Z-Ratio (2), Material 1
      • 9.4.33.5 Update Material Parameter, Control Loop (4), Material 1, PID (2)
      • 9.4.33.6 Query Sensor Parameter, Shutter Output (1), Sensor 1
      • 9.4.33.7 Update Sensor Parameter, Sensor Type (2), Sensor 1, CrystalTwo (1)
      • 9.4.33.8 Query Source Parameter, Shutter Output (2), Source 1
      • 9.4.33.9 Update Source Parameter, Number of crucibles (3), Source 1, 4 crucibles (1)
      • 9.4.33.10 Query Material Name, Material 1
      • 9.4.33.11 Update Material Name, Material 1, “SILVER”
      • 9.4.33.12 Query Input Name, Input 1
      • 9.4.33.13 Update Input Name, Input 1, “P1”
      • 9.4.33.14 Query Output Name, Output 1
      • 9.4.33.15 Update Output Name, Output 1, “SHUTTER”
      • 9.4.33.16 Query Output Type, Output 1
      • 9.4.33.17 Update Output Type, Output 1, Normally Closed (1)
      • 9.4.33.18 Query User Message, Message 1
      • 9.4.33.19 Update User Message, Message 1, “HELLO!”
      • 9.4.33.20 Query Logic Statement, Statement 1
      • 9.4.33.21 Update Logic statement, Statement 1, “IF External Input 1 THEN Start 1”
      • 9.4.33.22 Status Material, Thickness (4), Material 1
      • 9.4.33.23 Status Sensor, Crystal Life (0), Sensor 1
      • 9.4.33.24 Remote General Action, Stop All
      • 9.4.33.25 Remote Material Action, Open Source Shutter (8)
      • 9.4.33.26 Example for Interpreting Float Responses
• Chapter 10 Maintenance and Calibration Procedures
  • 10.1 Importance of Density, Tooling and Z-Ratio
  • 10.2 Determining Density
  • 10.3 Determining Tooling
  • 10.4 Laboratory Determination of Z-Ratio
  • 10.5 Source Maintenance
    • 10.5.1 Source Maintenance Parameters
      • 10.5.1.1 Crucible Rotation
      • 10.5.1.2 Toggle Sensor and Source Shutter
      • 10.5.1.3 Start/Stop Manual Power
  • 10.6 System Status
• Chapter 11 Counters & Timers
  • 11.1 Introduction
• Chapter 12 USB Storage
  • 12.1 File Handling (USB)
    • 12.1.1 USB Storage Devices
  • 12.2 Directory Structure
  • 12.3 Configuration Files
  • 12.4 Data Logs
  • 12.5 Screen Captures
• Chapter 13 Troubleshooting, Status and Error Messages
  • 13.1 Status Messages
  • 13.2 User Messages
  • 13.3 STOP messages
  • 13.4 Transient Messages
  • 13.5 Input Error Messages
  • 13.6 Troubleshooting Guide
    • 13.6.1 Troubleshooting the Cygnus 2
    • 13.6.2 Troubleshooting Transducers/Sensors
    • 13.6.3 Troubleshooting Computer Communications
  • 13.7 Replacing the Crystal
    • 13.7.1 Front Load
    • 13.7.2 Cool Drawer
    • 13.7.3 Shuttered and Dual Sensors
    • 13.7.4 Bakeable Sensor
    • 13.7.5 Sputtering Sensor
    • 13.7.6 Crystal Snatcher
    • 13.7.7 CrystalSix (XtalSix)
  • 13.8 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2
    • 13.8.1 Diagnostic Procedures
      • 13.8.1.1 Measurement System Diagnostic Procedure
      • 13.8.1.2 Feedthrough Or In-Vacuum Cable Diagnostic Procedure
      • 13.8.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure
      • 13.8.1.4 System Diagnostics Pass But Crystal Fail Message Remains
    • 13.8.2 % XTAL Life
    • 13.8.3 Sensor Cover Connection
      • 13.8.3.1 Compatible Sensor Heads
      • 13.8.3.2 Incompatible Sensor Heads
    • 13.8.4 Specifications
• Chapter 14 Measurement and Control Theory
  • 14.1 Basics
    • 14.1.1 Monitor Crystals
    • 14.1.2 Period Measurement Technique
    • 14.1.3 Z-match Technique
    • 14.1.4 Active Oscillator
    • 14.1.5 ModeLock Oscillator
    • 14.1.6 Auto-Z Theory
    • 14.1.7 Control Loop Theory
• Appendix A Material Table
  • A.1 Introduction
• Index
  • A
    • acoustic impedance 14-9
    • active oscillator 14-6, 14-8
    • Activity 3-12
    • aerial mass density 14-10
    • aggregate
    • anharmonic 3-29, 14-2, 14-7, 14-9
    • AT
    • Auto Z 3-29, 10-1
    • averaging time 5-15
  • C
    • cable noise 2-6
    • calibration 10-3
    • Checksum 9-8
    • CLEAR 3-1, 6-4, 6-8
    • Communications
    • control
    • controller
    • crucible 3-28
    • crystal
    • Crystal12 3-27
    • CrystalSix 3-27
    • CrystalTwo 3-26
    • Customer Service 1-6
    • Customer Support
  • D
    • DAC 2-8, 4-7
    • data entry 3-1
    • datalog 3-36
    • Declaration Of Contamination 1-6
    • density 5-3
    • DTE 2-11
  • E
    • earth ground 1-4, 2-4
    • electrode-to-quartz bond 14-3
    • electromagnetic interference 2-7
    • Error Code 9-9
    • evaporation source. 14-11
    • event condition 8-7
  • F
    • feed ramp 5-13
    • File Access Code 3-33, 6-9
    • film-induced stress 14-11
    • fit, weighted least-square-exponential 14-12
    • Frequency Response Method 14-11
    • fundamental 3-29, 14-7, 14-8, 14-9
  • H
    • Handheld Controller 3-31
    • hardware handshaking 9-5
  • I
    • I/O 7-1, 8-1
    • IAE 14-13
    • idle ramp 5-13
    • Input/Relay module 2-9
    • integral time 14-13
    • IP Address 9-2
    • ISE 14-13
    • ITAE 14-14
  • L
    • Laplace transform 14-12
    • Lock Code 6-8
    • logic statement 8-1, 8-17
  • M
    • mass sensitivity 14-1
    • material
    • measured deposition rate 14-13
    • measurement sensor 4-1
    • mode hopping 14-7
    • ModeLock oscillator 14-9
    • multiple layer deposition 10-4
  • N
    • net mask 6-4
  • O
    • Open Loop Method 14-11
  • P
    • parameter
    • Parenthesis 8-5
    • period measurement technique 14-4
    • PID 5-4, 14-11, 14-12
    • power 14-12
    • process
    • Program Lock code 3-33
    • pulse accumulator 14-4
  • Q
    • Quality 5-8
    • quality rate control 14-5
    • quartz crystal 14-1, 14-14
    • quasiharmonic 14-2, 14-9
  • R
    • rate
    • rate deviation 5-8
    • rate set point 14-13
    • RateWatcher 3-31, 5-17
    • reference oscillator 14-4
    • remote communication 9-1
    • Repair Service 1-6
    • resonance 14-6
    • Retry 9-1
    • RS-232 9-5
    • RS-232C 2-11, 9-1
  • S
    • Sales and Customer Service 1-6
    • sensor
    • serial communication 2-11
    • series resonance 14-8
    • Service Center 1-6
    • source
    • spreadsheet program 3-39
    • spurious shift 14-10
    • status code 9-11
    • Subnet mask 9-2
    • Suspend 3-25
  • T
    • TEST mode 6-7
    • test mode 3-32
    • THICKNESS EQUATION 6-2
    • thickness shear mode 14-2
    • thickness twist mode 14-2
    • Time-Power 3-24
    • tooling 10-2
    • turret
  • U
    • USB 12-1
  • W
    • windup 14-14
    • wire feed 5-13
    • wired remote 3-31
  • Z
    • Z-match equation 14-5
    • Z-ratio 3-11, 5-3, 10-1, 10-3, 14-9