Document Outline

• OPERATION AND SERVICE MANUAL
• MODEL MDC-370
• MAXTEK AVERAGING DEPOSITION CONTROLLER
• P/N 600800
• S/N _____________
• MAXTEK, INC.
• WARRANTY
• DISCLOSURE
• SAFETY
• Table of Contents
• Table of Figures
• List of Tables
• 1. GENERAL DESCRIPTION
  • 1.1 PURPOSE
  • 1.2 FEATURES
    • 1.2.1 MULTI-CRYSTAL AVERAGING
    • 1.2.2 EXTENSIVE PROGRAM STORAGE
    • 1.2.3 DYNAMIC MEASUREMENT UPDATE RATE
    • 1.2.4 SUPERIOR GRAPHICS DISPLAY
    • 1.2.5 PROGRAM SECURITY
    • 1.2.6 DESIGNED FOR UNATTENDED OPERATION
    • 1.2.7 FAIL SAFE ABORTS
    • 1.2.8 ABORT STATUS RETENTION
    • 1.2.9 RUN COMPLETION ON CRYSTAL FAILURE
    • 1.2.10 POWERFUL SYSTEM INTERFACE
    • 1.2.11 POWER SUPPLY NOISE TOLERANCE
    • 1.2.12 INTERNATIONAL STANDARD POWER CONNECTOR
    • 1.2.13 FIELD UPGRADABLE
  • 1.3 SPECIFICATIONS
    • 1.3.1 MEASUREMENT
    • 1.3.2 DISPLAY
    • 1.3.3 COMMUNICATION
    • 1.3.4 PROGRAM STORAGE CAPACITY
    • 1.3.5 PROCESS PARAMETERS
    • 1.3.6 MATERIAL PARAMETERS
    • 1.3.7 INPUT/OUTPUT CAPABILITY
    • 1.3.8 SENSOR PARAMETERS
    • 1.3.9 SOURCE PARAMETERS
    • 1.3.10 RECORDER PARAMETERS
    • 1.3.11 UTILITY SETUP PARAMETER
    • 1.3.12 OTHER
  • 1.4 ACCESSORIES
• 2. FRONT PANEL DISPLAYS AND CONTROLS
  • 2.1 OPERATING DISPLAYS
    • 2.1.1 RATE
    • 2.1.2 POWER
    • 2.1.3 THICKNESS
    • 2.1.4 LAYER NUMBER
    • 2.1.5 CRYSTAL HEALTH %
    • 2.1.6 TIME DISPLAY
  • 2.2 PARAMETER/STATUS DISPLAYS
  • 2.3 OPERATING CONTROLS
    • 2.3.1 MANUAL KEY
    • 2.3.2 START KEY
    • 2.3.3 ABORT KEY
    • 2.3.4 RESET KEY
    • 2.3.5 ZERO KEY
    • 2.3.6 SHUTTER KEY
    • 2.3.7 STATUS KEY
    • 2.3.8 GRAPH KEY
    • 2.3.9 ARROW KEYS
    • 2.3.10 PROGRAM KEY
    • 2.3.11 ALPHANUMERIC KEYBOARD
• 3. BENCH CHECKOUT & INSPECTION
  • 3.1 INSPECTION
  • 3.2 INITIAL POWER UP
  • 3.3 SAMPLE PROGRAM
    • 3.3.1 MATERIAL #1 PARAMETERS
    • 3.3.2 MATERIAL #2 PARAMETERS
    • 3.3.3 PROCESS PARAMETERS
  • 3.4 SIMULATE OPERATION
  • 3.5 MANUAL OPERATION
  • 3.6 INSTALLING OPTION BOARDS
    • 3.6.1 SOURCE-SENSOR BOARD
    • 3.6.2 DISCRETE I/O BOARD
    • 3.6.3 IEEE-488 OPTION BOARD
  • 3.7 DIGITAL TO ANALOG CONVERTER (DAC) CHECKOUT
• 4. PROGRAMMING AND CONTROLLER SETUP
  • 4.1 GENERAL
    • 4.1.1 NAVIGATING THE MENU STRUCTURE
    • 4.1.2 ENTERING ALPHA CHARACTERS
    • 4.1.3 ENTERING TIME PARAMETERS
    • 4.1.4 COPYING AND DELETING
    • 4.1.5 PASSWORD PROTECTION
      • 4.1.5.1 VIEW/RUN PROCESS PASSWORD
      • 4.1.5.2 EDIT PROCESS PASSWORD
      • 4.1.5.3 EDIT MATERIAL PASSWORD
    • 4.1.6 ADJUSTING PARAMETER/STATUS DISPLAY CONTRAST
  • 4.2 GETTING STARTED
    • 4.2.1 UTILITY SETUP
    • 4.2.2 DAC SETUP
    • 4.2.3 SOURCE SETUP
    • 4.2.4 SENSOR SETUP
      • 4.2.4.1 EXAMPLE USING MAXTEK’S RSH-600 SIX CRYSTAL SENSOR HEAD
    • 4.2.5 INPUT, OUTPUT AND ACTION SETUP
    • 4.2.6 DISPLAY SETUP
    • 4.2.7 MATERIAL SETUP
      • 4.2.7.1 POWER RAMPS
      • 4.2.7.2 AUTOMATIC CRYSTAL SWITCHING
      • 4.2.7.3 RATE ESTABLISH
      • 4.2.7.4 RATE RAMPS
      • 4.2.7.5 RATE SAMPLE MODE
      • 4.2.7.6 RATE DEVIATION ALARM
    • 4.2.8 PROCESS SETUP
    • 4.2.9 STARTING A NEW PROCESS
    • 4.2.10 RESUMING A PROCESS FROM ABORT OR HALT
  • 4.3 DETAILED PROGRAMMING
    • 4.3.1 VIEW/EDIT PROCESS
      • 4.3.1.1 DEFINE A PROCESS
    • 4.3.2 VIEW/EDIT MATERIAL
      • 4.3.2.1 DEFINE A MATERIAL
    • 4.3.3 SYSTEM SETUP
      • 4.3.3.1 EDIT DISPLAY SETUP
      • 4.3.3.2 PROGRAM INPUTS
      • 4.3.3.3 PROGRAM OUTPUTS
        • 4.3.3.3.1 ENTERING A CONDITION STRING
        • 4.3.3.3.2 CONDITION TYPES
      • 4.3.3.4 PROGRAM ACTIONS
      • 4.3.3.5 EDIT SENSOR SETUP
      • 4.3.3.6 EDIT SOURCE SETUP
      • 4.3.3.7 EDIT DAC SETUP
      • 4.3.3.8 EDIT UTILITY SETUP
• 5. OPERATING THE MDC-370
  • 5.1 SIGN-ON SCREEN
  • 5.2 STARTING A NEW PROCESS
  • 5.3 STARTING A NEW LAYER
  • 5.4 RESUMING AN ABORTED OR HALTED PROCESS
  • 5.5 GRapH DISPLAYS
  • 5.6 STATUS DISPLAYS
  • 5.7 VIEWING RESULTS
  • 5.8 MODES
    • 5.8.1 PROCESS READY
    • 5.8.2 ABORT
    • 5.8.3 HALT (SOFT ABORT)
    • 5.8.4 IN PROCESS
    • 5.8.5 NOT SAMPLING
    • 5.8.6 PROCESS COMPLETE
    • 5.8.7 MANUAL
    • 5.8.8 SIMULATE
  • 5.9 STATES
  • 5.10 TROUBLE, ERROR AND WARNING MESSAGES
    • 5.10.1 DESCRIPTION
      • 5.10.1.1 MIN RATE&MAX POWER
      • 5.10.1.2 MAX RATE&MIN POWER
      • 5.10.1.3 SYSTEM SETUP MEMORY CORRUPTED
      • 5.10.1.4 PROCESS MEMORY CORRUPTED
      • 5.10.1.5 MATERIAL MEMORY CORRUPTED
      • 5.10.1.6 RATE EST. ERROR
      • 5.10.1.7 CRYSTAL FAILURE
      • 5.10.1.8 SOURCE FAULT
      • 5.10.1.9 SENSOR FAULT
      • 5.10.1.10 NO SENSORS ENABLED
      • 5.10.1.11 TIME POWER
      • 5.10.1.12 RATE DEV. ALARM
      • 5.10.1.13 ALARM ACTION
      • 5.10.1.14 CRYSTAL MARGINAL
      • 5.10.1.15 RATE DEV. ALERT
      • 5.10.1.16 MAX POWER ALERT
      • 5.10.1.17 MIN POWER ALERT
      • 5.10.1.18 ALERT ACTION
      • 5.10.1.19 XTAL FAIL SWITCH
      • 5.10.1.20 XTAL MRGN SWITCH
      • 5.10.1.21 RATE DEV. ATTEN
      • 5.10.1.22 MAXIMUM POWER
      • 5.10.1.23 MINIMUM POWER
      • 5.10.1.24 CHANGE POCKET...
      • 5.10.1.25 CHANGE CRYSTAL...
      • 5.10.1.26 ATTENTION ACTION
      • 5.10.1.27 CALIBRATION DONE
• 6. Tuning the MDC-370 Control Loop
  • 6.1 Control Loop Basics
  • 6.2 Control Loops Applied to Vacuum Deposition
  • 6.3 Establishing MDC-370 Control Loop Parameters
• 7. INPUT/OUTPUT CHARACTERISTICS
  • 7.1 SOURCE CONTROL VOLTAGE OUTPUT
  • 7.2 SENSOR INPUT
  • 7.3 DISCRETE OUTPUTS
  • 7.4 DISCRETE INPUTS
  • 7.5 DIGITAL-TO-ANALOG CONVERTER OUTPUTS
  • 7.6 DIGITAL-TO-ANALOG CONVERTER CONTROL INPUTS
• 8. CONTROLLER INSTALLATION
  • 8.1 MOUNTING
  • 8.2 PROPER GROUNDING
  • 8.3 EXTERNAL CONNECTIONS
    • 8.3.1 POWER
    • 8.3.2 VOLTAGE SELECTION
    • 8.3.3 GROUND LUG
    • 8.3.4 REMOTE POWER HANDSET
    • 8.3.5 SOURCE-SENSOR
    • 8.3.6 RS-232 COMMUNICATION
    • 8.3.7 DISCRETE INPUT/OUTPUT
    • 8.3.8 DIGITAL-TO-ANALOG CONVERTER (DAC)
• 9. SYSTEM INSTALLATION
  • 9.1 SENSOR HEAD DESCRIPTION
  • 9.2 SENSOR HEAD INSTALLATION
  • 9.3 SENSOR OSCILLATOR
    • 9.3.1 INSTALLATION
  • 9.4 INSTRUMENTATION FEEDTHROUGH
  • 9.5 SENSOR CRYSTAL REPLACEMENT
  • 9.6 TYPICAL SYSTEM INSTALLATION
• 10. THEORY OF OPERATION
  • 10.1 BASIC MEASUREMENT
  • 10.2 FILM THICKNESS CALCULATION
  • 10.3 CRYSTAL HEALTH CALCULATION
  • 10.4 RATE CALCULATION
  • 10.5 Multi-sensor averaging
  • 10.6 EMPIRICAL CALIBRATION
    • 10.6.1 FILM DENSITY
    • 10.6.2 TOOLING FACTOR
    • 10.6.3 ACOUSTIC IMPEDANCE
• 11. COMPUTER INTERFACE
  • 11.1 GENERAL
  • 11.2 RS-232 SERIAL INTERFACE
  • 11.3 RS-485 SERIAL INTERFACE
  • 11.4 IEEE-488 PARALLEL INTERFACE
  • 11.5 PROTOCOL
  • 11.6 DATA TYPES
  • 11.7 MESSAGE RECEIVED STATUS
  • 11.8 INSTRUCTION SUMMARY
  • 11.9 INSTRUCTION DESCRIPTIONS
• 12. REPAIR AND MAINTENANCE
  • 12.1 HANDLING PRECAUTIONS
  • 12.2 MAINTENANCE PHILOSOPHY
  • 12.3 TROUBLE SHOOTING AIDS
  • 12.4 RETURNING THE MDC-370 TO THE FACTORY
• 13. APPENDIX A
• 14. APPENDIX B – PARAMETER TEMPLATES
  • 14.1 MATERIAL
  • 14.2 PROCESS
  • 14.3 DISPLAY SETUP
  • 14.4 INPUTS
  • 14.5 OUTPUTS
  • 14.6 ACTIONS
  • 14.7 SENSOR SETUP
  • 14.8 SOURCE SETUP
  • 14.9 DAC SETUP
  • 14.10 UTILITY SETUP
• 15. INDEX
• 16. MENU MAP