Planning your panel layout, Bonding multiple subpanels – Rockwell Automation 2090 Ultra3000 Installation Manual User Manual

Page 36

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Publication 2098-IN003E-EN-P — April 2004

1-12

Installing Your Ultra3000

Bonding Multiple Subpanels

Bonding multiple subpanels creates a common low impedance exit
path for the high frequency energy inside the cabinet. Subpanels that
are not bonded together may not share a common low impedance
path. This difference in impedance may affect networks and other
devices that span multiple panels. Refer to the figure below for
recommended bonding practices.

Figure 1.6
Multiple Subpanels and Cabinet

Planning Your Panel Layout

This section outlines the practices which minimize the possibility of
noise-related failures as they apply specifically to Ultra3000
installations. For more information on the concept of electrical noise
reduction, refer to System Design for Control of Electrical Noise
(publication GMC-RM001x-EN-P).

Recommended:
Bond the top and bottom of each subpanel to the cabinet using
25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid.

Scrape the paint around each fastener to
maximize metal to metal contact.

Bonded cabinet

ground bus to

subpanel

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