Heat sink through-the-back mounting - frame e – Rockwell Automation 1336F PLUS II User Manual - Firmware 1.xxx-6.xxx User Manual

Page 191

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Dimensions

B–17

Heat Sink Through-the-Back Mounting - Frame E

489.0

(19.25)

508.0

1

(20.00)

477.3

(18.79)

1084.1

(42.68)

1095.8

(43.14)

1422.4

1

(56.00)

5.8

(0.23)

75.4

(2.97)

127.0

(5.00)

Cutout

26 Required
4.3 (0.171) Dia. for 10-32 x 9.7 (0.38) Self-Tap
4.0 (0.159) for 10-32 x 9.7 (0.38) Threaded

132.33 (5.21) *

5.8

(0.23)

127.0

(5.00)

54.1

(2.13)

All Dimensions in Millimeters and (Inches)

Back of Enclosure

Drive

* Minimum dimension allowed – More space will

improve fan effectiveness and heat dissipation.

1

Shading indicates approximate size

of drive inside enclosure.

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