Reset, Pin description, Nxp semiconductors – NXP Semiconductors LPC24XX UM10237 User Manual

Page 74

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UM10237_4

© NXP B.V. 2009. All rights reserved.

User manual

Rev. 04 — 26 August 2009

74 of 792

NXP Semiconductors

UM10237

Chapter 5: LPC24XX External Memory Controller (EMC)

8.

Reset

The EMC receives two reset signals. One is Power-On Reset (POR), asserted when chip
power is applied, and when a brown-out condition is detected (see the System Control
Block chapter for details of Brown-Out Detect). The other reset is from the external Reset
pin and the Watchdog Timer.

A configuration bit in the SCS register, called EMC_Reset_Disable, allows control of how
the EMC is reset. The default configuration (EMC_Reset_Disable = 0) is that both EMC
resets are asserted when any type of reset event occurs. In this mode, all registers and
functions of the EMC are initialized upon any reset condition.

If EMC_Reset_Disable is set to 1, many portions of the EMC are only reset by a power-on
or brown-out event, in order to allow the EMC to retain its state through a warm reset
(external reset or watchdog reset). If the EMC is configured correctly, auto-refresh can be
maintained through a warm reset.

9.

Pin description

Table 5–66

shows the interface and control signal pins for the EMC.

Table 66.

Pad interface and control signal descriptions

Name

Type

Value on POR
reset

Value during
self-refresh

Description

A[23:0]

Output 0x0000 0000

Depends on
static memory
accesses

External memory address output.
Used for both static and SDRAM
devices. SDRAM memories use only
bits [14:0].

D[31:0]

Input/
Output

Data outputs =
0x0000 0000

Depends on
static memory
accesses

External memory data lines. These
are inputs when data is read from
external memory and outputs when
data is written to external memory.

OE

Output 1

Depends on
static memory
accesses

Low active output enable for static
memory devices.

BLS[3:0]

Output 0xF

Depends on
static memory
accesses

Low active byte lane selects. Used
for static memory devices.

WE

Output 1

Depends on
static memory
accesses

Low active write enable. Used for
SDRAM and static memories.

CS[3:0]

Output 0xF

Depends on
static memory
accesses

Static memory chip selects. Default
active LOW. Used for static memory
devices.

DYCS[3:0]

Output 0xF

0xF

SDRAM chip selects. Used for
SDRAM devices.

CAS

Output 1

1

Column address strobe. Used for
SDRAM devices.

RAS

Output 1

1

Row address strobe. Used for
SDRAM devices.

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