Bump test application, Overview of the bump test application, Chapter 7 – Rockwell Automation 1441-PEN25-Z Enpac 2500 Data Collector User Manual
Page 195: Chapter
Rockwell Automation Publication GMSI10-UM002D-EN-E - August 2012
195
Chapter
7
Bump Test Application
The Enpac 2500 Bump Test application provides the Enpac 2500 with a simple
yet effective way of determining natural (or resonant) frequencies of a machine or
structure.
The Bump Test application is an add-on program to the Enpac 2500 and must be
installed with the Bump Test PCMCIA card from Rockwell Automation.
Refer to Adding Applications to the Enpac 2500 Data Collector on page 59
for
installation instructions.
Overview of the Bump Test
Application
A bump test (or hammer test) determines the natural frequencies of a machine or
a structure. The idea behind the test is that when an object is impacted or
‘bumped,’ the objects natural or resonant frequencies are excited. If a spectrum is
taken while the object is vibrating due to the impact, spectral peaks will result and
pinpoint the objects natural frequencies. The Enpac 2500 data collector can be
used to capture this frequency response and display a spectrum illustrating the
resonant frequencies.
Vibration forces transmitted by rotating machines often excite natural resonance
in structures attached to the machine. When these structural resonances appear,
vibration levels are amplified and can result in fatigue failures. Structural
resonances can also mask the cause of a machines vibration making it difficult to
implement corrective machine maintenance. The Bump Test identifies a
structures resonant modes and provides a maintenance engineer with the
opportunity to change the resonance frequency in order to reduce or eliminate
damaging vibration levels.
Topic
Page
Overview of the Bump Test Application
Setting Up and Collecting Bump Test Measurements
Reviewing Bump Test Measurements