Rockwell Automation 2098-IPD-xxx Ultra5000 Intelligent Positioning Drives Installation Manual - Manual (Page 25)

Publication 2098-IN001E-EN-P — April 2002
Installing Your Ultra5000 1-11
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit
path for the high frequency energy inside the cabinet. Subpanels that
are not bonded together may not share a common low impedance
path. This difference in impedance may affect networks and other
devices that span multiple panels. Refer to the figure below for
recommended bonding practices.
Figure 1.4
Multiple Subpanels and Cabinet
Recommended:
Bond the top and bottom of each subpanel to the cabinet
using 25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid.
Scrape the paint around each fastener
to maximize metal to metal contact.
Bonded cabinet
ground bus to
subpanel
Recommended:
Bond the top and bottom of each subpanel to the cabinet
using 25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid.
Scrape the paint around each fastener
to maximize metal to metal contact.
Bonded cabinet
ground bus to
subpanel