Rockwell Automation 2097-Vxxx Kinetix 350 Single-axis EtherNet/IP Servo Drive User Manual - Manual (Page 17)

Rockwell Automation Publication 2097-UM002A-EN-P - December 2013 17
Chapter
2
Install the Kinetix 350 Drive System
System Design Guidelines Use the information in this section when designing your enclosure and planning
to mount your system components on the panel.
For on-line product selection and system configuration tools, including
AutoCAD (DXF) drawings of the product, refer to
http://www.ab.com/e-tools .
System Mounting Requirements
• To comply with UL and CE requirements, the Kinetix 350 system must be
enclosed in a grounded conductive enclosure offering protection as
defined in standard EN 60529 (IEC 529) to IP4X such that they are not
accessible to an operator or unskilled person. A NEMA 4X enclosure
exceeds these requirements providing protection to IP66.
• The panel you install inside the enclosure for mounting your system
components must be on a flat, rigid, vertical surface that won’t be subjected
to shock, vibration, moisture, oil mist, dust, or corrosive vapors.
• Size the drive enclosure so as not to exceed the maximum ambient
temperature rating. Consider heat dissipation specifications for all drive
components.
• Segregate input power wiring and motor power cables from control wiring
and motor feedback cables. Use shielded cable for power wiring and
provide a grounded 360° clamp termination.
• Use high-frequency (HF) bonding techniques to connect the enclosure,
machine frame, and motor housing, and to provide a low-impedance
return path for high-frequency (HF) energy and reduce electrical noise.
Topic Page
System Design Guidelines 17
Electrical Noise Reduction 25
Mount Your Kinetix 350 Drive 33
ATTENTION: Plan the installation of your system so that you can perform all
cutting, drilling, tapping, and welding with the system removed from the
enclosure. Because the system is of the open type construction, be careful to
keep any metal debris from falling into it. Metal debris or other foreign matter
can become lodged in the circuitry, which can result in damage to components.