Ground multiple subpanels, Power wiring requirements – Rockwell Automation 2097-Vxxx Kinetix 350 Single-axis EtherNet/IP Servo Drive User Manual User Manual
Page 59
Rockwell Automation Publication 2097-UM002C-EN-P - December 2013
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Connect the Kinetix 350 Drive System Chapter 4
Figure 33 - Chassis Ground Configuration (multiple Kinetix 350 drives on one panel)
Ground Multiple Subpanels
To ground multiple subpanels, refer to the figure below. HF bonding is not
illustrated. For information, refer to
Figure 34 - Subpanels Connected to a Single Ground Point
Power Wiring Requirements
Wire must be copper with 75 °C (167 °F) minimum rating. Phasing of main AC
power is arbitrary and an earth ground connection is required for safe and proper
operation.
Refer to
for interconnect diagrams.
Bonded Ground Bar
(optional)
Bonded Cabinet
Ground Bus
Ground Grid or Power
Distribution Ground
Always follow NEC and
applicable local codes.
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Always follow NEC and
applicable local codes.
Ground Grid or Power
Distribution Ground
Bonded Ground
Bus
IMPORTANT
The National Electrical Code and local electrical codes take precedence over the
values and methods provided.