INFICON STC-2002 Thin Film Deposition Controller Operating Manual - Manual (Page 115)

p STC-2002 DEPOSITION CONTROLLER y
SECTION 3.XX e page 113 of 276 ^
differentiation in that if it is followed by two periods, this means that there is no sensor card installed for
this crystal channel, otherwise the presence of 2 zeroes indicates that the sensor card is installed and
enabled (by menu parameter) and in an OFF condition.
general form: XYYXZZ where X=Letter Code, YY= starting XTAL%, ZZ= ending XTAL%
starting group ending group
XTAL 1 A91A89 = Crystal 1 started a process as active at 91% life and ended a process as active at 89% life.
XTAL 3 A97F71 = Crystal 3 started a process as active at 97% life and ended a process as failed at 71% life.
XTAL 5 O00O00 = Crystal 5 started a process as OFF at zero% life and ended a process as OFF at zero%
life (00 usually indicates that no crystal is connected).
XTAL 7 O21O021 = Crystal 7 started a process as OFF at 21% life and ended a process as OFF at 21% life.
XTAL 8 O..O..
= Crystal 8 is OFF and has no supporting sensor card installed.
The vital parameters stored and displayed are:
RUN:
Run number - increments at the start of each process cycle (beginning at layer #1).**
DATE: MMDDYY representation of date the film was started.
TIME: The time of the start of the run (from the 24 hour clock of the STC-2002).
P TIME: Process time - the time from a Start initiation to end of the Film Process.
COMPLT: Mode of completion of the deposition.
NORMAL-
Normal completion of run
TMPWR- Xtal failure occurred, run completed on time-power *
BADXTL- Bad Xtal terminated run
REMOTE- External input terminated run
KEYBRD- Front keypad STOP BUTTON terminated run
MAXPWR- MAX POWER limit exceeded, run terminated *
PENDNT- STOP button on Hand Controller terminated run
FILM# Film # used
PROC# Process# used
LAYER# Layer # used
MAP# Map# used
SRC# Source channel # used
P O CK E T# Pocket # (of indexer) used
D TIME: Deposition time - the time the source shutter is open in Minutes:Seconds format.
THICK: Thickness at end of deposition in Angstroms.
RATE: Deposition rate at end of deposition in Å/Sec.
POWER: Deposition power for last three seconds of deposition in %.
LOOP: Accumulated counts in the control quality accumulator. See Section x2.17 for a
description of this value.
XTAL 1: The start and ending crystal percent life is shown. See letter code table below.
XTAL 2: Same as above.
XTAL 3: Same as above.
XTAL 4: Same as above.
XTAL 5: Same as above.
XTAL 6: Same as above.
XTAL 7: Same as above.
XTAL 8: Same as above.
* programmable feature
** The letter T appears after the run# when the TEST mode was used.
Note: [STAB: Accumulated counts in the crystal stability accumulator not reported here. See 2 nd STATUS screen.]
Purge will clear Process Accounting contents (see section x2.6x, Factory Settings vs... and section x2.21,
Check Sum Validation).
Crystal % Life Letter Code Table
O = Off
M = Missing
A = Active B = Standby
D = Dropped S = Switched
F = Failed