INFICON STC-2002 Thin Film Deposition Controller Operating Manual User Manual

Page 42

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p STC-2002

DEPOSITION CONTROLLER

y

SECTION 2.XX

e page 40 of 276 ^


Initial Programming Setups (menu parameters)

system configuration programming (factory/ default settings, stand alone / computer controlled)

If the STC-2002 has: arrived directly from the factory or the factory settings key has been menu selected or
the purged settings key has been menu selected, the following specifies the parameter values in effect.
The following information will be repeated in later sections in greater detail along with additional related
information. The intent here is to introduce the reader to baseline values and consequently what must be
altered for the intended use. Purge values are listed first, followed by the factory differences.

Film Parameter values after purge:

Communication values after purge:

[non-SEQ adds "Final Thick Limit=0.0 KÅ"]

Material Density

1.00 gm/cc

COM/IO Lock Code

0

Material

Z-Factor

1.000

Keyboard

Beep

ON

Setpoint thick limit

0.000 KÅ

RS232 Baud Rate

9600

Setpoint time limit

0:00 MM:SS

RS232 Protocol

Sycon

Soak 1 Power Value

0.0%

Power Ramp 1 Time

0:00 MM:SS

System Configuration values after purge:

Power Soak 1 Time

0:00 MM:SS

Soak

2

Power

Value

0.0%

LCD

Contrast

MEDIUM

Power Ramp 2 Time

0:00 MM:SS

Password Lock #

0

Power Soak 2 Time

0:00 MM:SS

Run Number

0

Soak 3 Power Value

0.0%

Recorder Functions

Off

Power Ramp 3 Time

0:00 MM:SS

Recorder Output Channel 1

(note conflict: Source Sensor Out is also1)

Deposit

Rate

0.0

A/S

Clock

Time

no

change

(HH/MM/SS)

Rate

Ramp

Mode

OFF

(w/o

battery:

00/01/00)

New Deposit Rate

0.0 A/S

Clock Date

no change (MM/DD/YY)

Rate

Ramp

Time

0:00

MM:SS

(w/o

battery:

01/01/01)

Rate Ramp Trigger

0.000 KÅ

Need SS Card 1

ON

Control

Loop

P

100

Need

SS

Card

2-4 Off

Control Loop I

1.0 secs

I/O Slot x Type

Disabled

(where x = 1 to 4)

Control Loop D

1.0 secs

Memory Module IFC

OFF/ON (optional)

Max

Power

Limit

0.0%

Run Time Screen after PURGE:

Abort Max Power SW

ON

Max Power Dwell

0:30 MM:SS

PROC

ess

1

note1

Shutter

Delay

Mode

Off

Layer

#

note1

Shutter Delay Timeout

0:30 MM:SS

FILM (film in use)

1

Shutter

Delay

Quality

10

SRC

(Source Control Volts Channel)

1

Rate

Sampling

Off

XTAL

(blank)

Sample

Interval

0:30

MM:SS

MAP#

1

Sample Dwell Time

0:30 MM:SS

RUN time

0:00

Sample

Quality

10

PHASE

time

0:00

Sample

Alarm

Time

0:30

MM:SS

RUN#

0

Film Fail Mode

Time Power

(Graph parameter)

Rate Deviation

Control Loop Quality L 0

Crystal Quality

L/Q

(Sample/Hold = blank)

XTAL

Stability

S

0

XTAL Life Bounds

0.0%

MAIN MENU Screen after PURGE:

Plot Vert Scale Volts

100

Plot Horiz Scale H

1

Review Film

(film 1 will be reviewed)

Data Plot Type

RATE DEV

Review SS Map

(Map 1 will be reviewed)

SS

Map

Select

1 Next

Process

1

Pocket

Select

0 Review

Processes

(Process 1 will be reviewed)

Etching Mode

Off (pos/neg)

note1: non-sequencing mode does not have this function (non-SEQ: ACTIVE FILM is 1).


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