INFICON STC-2002 Thin Film Deposition Controller Operating Manual - Manual (Page 38)

p STC-2002 DEPOSITION CONTROLLER y
SECTION 2.XX e page 36 of 276 ^
presented here does not adequately describe the many hazardous situations that could occur brought about
by the incorrect constellation of valve states, temperatures, pressures and voltages. The system needs to
have safety provisions should inadvertent human intervention cause changes or should a power failure of
any or all parts of the system occur. Safety concerns include electrocution and explosion.
. (reiteration of
above) .
programmable hardware setup discussion (for detailed setup see Section x3 but please read this overview section first)
Synopsis:
Select mode: sequencing/runtime, sequencing/test, non-sequencing/runtime, non-sequencing/test.
Optional selects: manual mode and test mode. Select memory configuration: factory, purged, as-is.
Program system parameters. Program film parameters (for a single film or multiple films) and process
steps. Set active process. Select crystal. Start process.
The versatility of the STC-2002 translates into many modes, parameters and configurations all of which
arrive from the factory in default states. Except for the Input card hardware configurations (uses jumpers),
all modes, parameters and configurations are menu programmable. The VAR or end user must tailor the
unit to work with specific hardware for the desired deposition process.
The VAR or end user must tailor the
unit to the specific hardware and deposition process at hand .
Run time mode is the general name for the mode used for the deposition process whose screen can
always be brought forth from any menu screen by pressing the fixed front panel key labeled STATUS.
[A second press of the STATUS key while the Run Time screen is displayed will invoke a screen showing, among
other elements, active control output channel[s], pocket number[s] and power % expended on each. A third press of the
STATUS key beginning when the Run Time screen was displayed will invoke a screen showing, among other
elements, active sensor channels and their states, rates, thickness', stability's and crystal lives. This second screen can
be used to fail or reinstate (re-verify) a crystal. Zero thickness at this level is used for tooling setup or diagnostics and
has no effect on the deposition thickness.]
The specific functional run time mode must be chosen: sequencing or non-sequencing. Either of
these modes can be further switched between the normal run mode and the test mode. This results in 4
mode choices:
sequencing/run, sequencing/test, non-sequencing/run, non-sequencing/test. Manual mode
(manual control of power) can be selected while a process is running by pressing the fixed front panel
MANUAL key with the pendent connected.
At the same time that these choices are being made, the programmable memory can be kept as it
is, purged or set to factory defaults. A memory change can effect film parameters, process steps, run time
mode, system configuration, I/O programming, process accounting, and communication parameters.
Elsewhere in this manual (appears section 3.21) are tables and lists depicting memory element values after
purge and after factory [settings] are invoked. This memory information by itself is also listed later in this
section.
A film is programmed by selecting the film number (on the main menu), moving through the
associated parameter list, and changing the values as needed. Some of the film parameters are not
accessible or viable when another related film parameter predicates their availability. Up to 99 films can
be programmed. In non-sequencing mode, only 1 film can be run at a time, as there is only one implicit
process. In sequencing mode, a process can call for a film in a process step. There can be up to 99 steps in
a process and up to 9 processes. A process is menu programmed by building each line (step) with a mode
value, film number and thickness value.
In the non-sequencing mode, an active film must be menu selected (1 of 99). In the sequencing
mode, an active process must be menu selected (1 of 9). In either case, active indicates that this is the film
or process that will become active when the process starts (initiated by the front panel START key). In
addition, neither a film nor a process may be altered by editing when either is being used in a running
deposition (for safety reasons).
Some system configuration parameters also determine the status of some film and map
parameters. Example configuration parameters that fall into this category are: need s/s card x and I/O slot
x type. Check the film parameter dependency list in section X1.8X to find the parameter of interest (all
parameters are listed there). Finally, set the status of the controlling parameter such that it allows the