System design guidelines, System mounting requirements – Rockwell Automation 2198-Hxxx Kinetix 5500 Servo Drives User Manual User Manual

Page 30

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Rockwell Automation Publication 2198-UM001D-EN-P - May 2014

Chapter 2

Planning the Kinetix 5500 Drive System Installation

System Design Guidelines

Use the information in this section when designing your enclosure and planning
to mount your system components on the panel.

For on-line product selection and system configuration tools, including
AutoCAD (DXF) drawings of the product, refer to

http://www.rockwellautomation.com/en/e-tools

.

System Mounting Requirements

To comply with UL and CE requirements, the Kinetix 5500 drive systems

must be enclosed in a grounded conductive enclosure offering protection
as defined in standard EN 60529 (IEC 529) to IP54 such that they are not
accessible to an operator or unskilled person. A NEMA 4X enclosure
exceeds these requirements providing protection to IP66.

The panel you install inside the enclosure for mounting your system

components must be on a flat, rigid, vertical surface that won’t be subjected
to shock, vibration, moisture, oil mist, dust, or corrosive vapors.

Size the drive enclosure so as not to exceed the maximum ambient

temperature rating. Consider heat dissipation specifications for all drive
components.

Combined motor power cable length for all axes on the same DC bus must

not exceed 250 m (820 ft). Drive-to-motor cables must not exceed 50 m
(164 ft), however use of continuous-flex cable and 2198-H2DCK
converter kit limits the maximum length. Refer to

Table 5

on

page 27

for

specifications by frame size.

Ethernet cable lengths connecting drive-to-drive, drive-to-controller, or

drive-to-switch must not exceed 100 m (328 ft).

Registration and digital input cables greater than 30 m (98.4 ft) must be

shielded.

Segregate input power wiring from control wiring and motor cables.
Use high-frequency (HF) bonding techniques to connect the modules,

enclosure, machine frame, and motor housing, and to provide a low-
impedance return path for high-frequency (HF) energy and reduce
electrical noise.
Bond drive, capacitor module, and line filter grounding screws by using a
braided ground strap as shown in

Figure 39 on page 73

.

Refer to the System Design for Control of Electrical Noise Reference Manual,
publication

GMC-RM001

, to better understand the concept of electrical noise

reduction.

IMPORTANT

System performance was tested at these cable length specifications.
These limitations also apply when meeting CE requirements.

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