System design guidelines, System mounting requirements – Rockwell Automation 2097-Vxxx Kinetix 300 EtherNet/IP Indexing Servo Drive User Manual User Manual
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Rockwell Automation Publication 2097-UM001D-EN-P - November 2012
Chapter 2
Installing the Kinetix 300 Drive System
System Design Guidelines
Use the information in this section when designing your enclosure and planning
to mount your system components on the panel.
For on-line product selection and system configuration tools, including
AutoCAD (DXF) drawings of the product, see
System Mounting Requirements
• To comply with UL and CE requirements, the Kinetix 300 system must be
enclosed in a grounded conductive enclosure offering protection as
defined in standard EN 60529 (IEC 529) to IP4X such that they are not
accessible to an operator or unskilled person. A NEMA 4X enclosure
exceeds these requirements providing protection to IP66.
• The panel you install inside the enclosure for mounting your system
components must be on a flat, rigid, vertical surface that won’t be subjected
to shock, vibration, moisture, oil mist, dust, or corrosive vapors.
• Size the drive enclosure so as not to exceed the maximum ambient
temperature rating. Consider heat dissipation specifications for all drive
components.
• Segregate input power wiring and motor power cables from control wiring
and motor feedback cables. Use shielded cable for power wiring and
provide a grounded 360° clamp termination.
• Use high-frequency (HF) bonding techniques to connect the enclosure,
machine frame, and motor housing, and to provide a low-impedance
return path for high-frequency (HF) energy and reduce electrical noise.
•
See the System Design for Control of Electrical Noise Reference Manual,
publicatio
o better understand the concept of electrical noise
reduction.
IMPORTANT
System performance was tested at these cable length specifications. These
limitations are also a CE requirement.