INFICON IQM-233 Thin Film Deposition Controller PCI-Express Card Codeposition Software Operating Manual - Manual (Page 105)

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IQS-233 Operating Manual
2.4 Configuring a Process
This section provides a general overview on how to use the IQS-233 Codeposition
software to configure a process with user selected parameters. For help installing
or opening software, refer to:
 section 2.2, Installing IQS-233 Codeposition Software, on page 2-1
 section 2.3.2, Logging On to the Software, on page 2-7
2.4.1 Process Example
A typical thin film deposition cycle, shown in Figure 2-65 , is comprised of three
distinct phases:
(1) Preconditioning (ramp/soak)
(2) Deposition
(3) Postconditioning (feed/idle)
Figure 2-65 Typical Deposition Process
During preconditioning, power is applied to prepare the source material for
deposition. The first ramp/soak preconditioning phase is used to bring the material
to a uniform molten state. The second ramp/soak preconditioning phase is typically
set to a power that is near the power required to achieve the desired deposition
rate.
When preconditioning ends, PID rate control of deposition begins. Initially, the
substrate material may remain shuttered until the desired deposition rate is
achieved (shutter delay). Once the control loop achieves the desired rate, the
shutter opens and deposition begins. Multiple deposition rates (rate ramps) can be
programmed. (Refer to
section 2.3.3.5.5 on page 2-26 ).
Power
Ramp
1
Soak
1
Ramp
2
Soak
2
Shutter
Delay
Deposit Feed Idle End of
Process
Rate 1
Rate 2
Rate 3