INFICON IQM-233 Thin Film Deposition Controller PCI-Express Card Codeposition Software Operating Manual - Manual (Page 124)

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IQS-233 Operating Manual
9 Adjust PID Values according to control response.
9a Click Man -> Auto (changes to Auto -> Man) to activate PID control and
observe the power.
 The power should rise from 0% and stabilize near PWR
DR.
 If there is more than 10% overshoot in power or if the curve appears
under damped, lower the P value. If the time to reach PWR
DR
is very
slow (over damped), increase the P value. See Figure 4-3 .
 A lower I value will increase response for over damped sources. A
higher value may reduce ringing and rate deviations seen with under
damped sources. See
Figure 4-3 .
 The D value should not need much adjustment, but if under damped
behavior is observed, increase the D value. If it appears over damped,
decrease the D value. See
Figure 4-4 .
9b Continue to adjust P and I values, alternating between 0% power in
Manual mode and Auto mode until the steady-state response is smooth
and the step response is controlled.
9c If finished, slowly decrease power to 0%, and then press Stop.
NOTE: Preconditioning will minimize step changes.
NOTE: E-beam systems may require additional steps to limit the control loop
response during arcing. First, be sure the Max Power parameter in the
Source/Sensor tab of the Film Edit window (Edit >> Films) is set to
limit the output power to a reasonable value for the material and rate.
The Slew Rate setting can further limit aggressive power changes. At
rates below 10 Å/s, a Slew Rate of 1 - 2% is common.