Document Outline

• Cover Page
• Title Page
• Trademarks
• Declaration Of Conformity
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Introduction
    • 1.1.1 Related Manuals
  • 1.2 Instrument Safety
    • 1.2.1 Definition of Notes, Cautions and Warnings
    • 1.2.2 General Safety Information
    • 1.2.3 Earth Ground
    • 1.2.4 Main Power Connection
  • 1.3 How To Contact Customer Support
    • 1.3.1 Returning Your Cygnus to INFICON
  • 1.4 Cygnus Specifications
    • 1.4.1 Measurement
    • 1.4.2 Screens and Parameters
      • 1.4.2.1 Instrument Set Up Parameters
      • 1.4.2.2 Set Up Parameters for Each Source
    • 1.4.3 User Interface
    • 1.4.4 Display
    • 1.4.5 Source / Recorder Outputs
    • 1.4.6 Logic Processing
    • 1.4.7 Relays / Inputs
    • 1.4.8 Remote Communications
    • 1.4.9 Accessories
    • 1.4.10 Power
    • 1.4.11 Operating Environment
    • 1.4.12 Storage Temperature
    • 1.4.13 Warm Up Period
    • 1.4.14 Size
    • 1.4.15 Connector Clearance Requirements
    • 1.4.16 Weight
    • 1.4.17 Cleaning
  • 1.5 Unpacking and Inspection
  • 1.6 Parts and Options Overview
    • 1.6.1 Base Configurations
    • 1.6.2 PreInstalled Options or Spares
    • 1.6.3 Oscillator Packages, Optional Accessories, and Sensors
  • 1.7 Initial PowerOn Verification
• Chapter 2 Operation
  • 2.1 Front Panel Controls
  • 2.2 Rear Panel Interfaces
  • 2.3 Displays
    • 2.3.1 ALL CHANNELS Display
      • 2.3.1.1 GENERAL PARAMETERS Display
      • 2.3.1.2 General MAINTENANCE Display
        • 2.3.1.2.1 All Channels Sensor MAINTENANCE Display
      • 2.3.1.3 CHANNEL Display
        • 2.3.1.3.1 Channel Parameters Display
          • 2.3.1.3.1.1 HARDWARE PROCESS Display
        • 2.3.1.3.2 Channel SENSOR MAINTENANCE Display
          • 2.3.1.3.2.1 Channel SOURCE MAINTENANCE Display
  • 2.4 Crystal Life, Starting Frequency and Activity
  • 2.5 Defining a Process
    • 2.5.1 Executing a Process
  • 2.6 State Descriptions
  • 2.7 Special Features
    • 2.7.1 Crystal Switching
    • 2.7.2 Rotary Sensor Crystal Switching
    • 2.7.3 Source/Crucible Selection
      • 2.7.3.1 Example: Programming Turret Source Crucible Selection
    • 2.7.4 Hand-Held Controller
    • 2.7.5 Test Mode
    • 2.7.6 Floppy Disk (Optional)
    • 2.7.7 Lock Codes
    • 2.7.8 Datalog
    • 2.7.9 Auto Soak 2
• Chapter 3 Channel Parameters
  • 3.1 Introduction
  • 3.2 Channel Parameters
    • 3.2.1 Channel Parameter Definitions
  • 3.3 Channel Hardware Parameters
    • 3.3.1 Channel Hardware Parameters Definition
• Chapter 4 General Parameters
  • 4.1 Introduction
  • 4.2 General Parameter Display
  • 4.3 General Parameters Definition
  • 4.4 Logic Directory Set Up
    • 4.4.1 Logic Statement Overview
    • 4.4.2 Editing Logic Statements
      • 4.4.2.1 Logic Statement Directory
      • 4.4.2.2 Logic Statements
      • 4.4.2.3 Logic Statement Event Editing
        • 4.4.2.3.1 Event Definitions (IF)
      • 4.4.2.4 Logic Statement Action Editing
        • 4.4.2.4.1 Action Definitions (THEN)
  • 4.5 Counters Timers
  • 4.6 I/O Map
  • 4.7 Floppy Disk
• Chapter 5 Remote Communications
  • 5.1 Remote Communications Overview
  • 5.2 Physical Connections
    • 5.2.1 RS232C Serial Port
    • 5.2.2 IEEE488 Port
  • 5.3 Message Protocols
    • 5.3.1 INFICON Cygnus Message Formats
    • 5.3.2 Basic Protocol
      • 5.3.2.1 Command Packet (Host to Instrument Message)
      • 5.3.2.2 Response Packet (Instrument to Host Message)
  • 5.4 Cygnus Communication Commands
    • 5.4.1 ECHO Command
    • 5.4.2 HELLO Command
    • 5.4.3 Parameter Commands
      • 5.4.3.1 All Parameters
        • 5.4.3.1.1 Query All Parameters
        • 5.4.3.1.2 Update All Parameters
      • 5.4.3.2 Channel Parameters
        • 5.4.3.2.1 Query Channel Parameters
        • 5.4.3.2.2 Update Channel Parameters
      • 5.4.3.3 General Parameters
        • 5.4.3.3.1 Query General Parameters
        • 5.4.3.3.2 Update General Parameters
      • 5.4.3.4 Input Name Parameters
        • 5.4.3.4.1 Query Input Name
        • 5.4.3.4.2 Update Input Names
      • 5.4.3.5 Logic Statements Parameters
        • 5.4.3.5.1 Query Logic Statements
        • 5.4.3.5.2 Update Logic Statements
      • 5.4.3.6 Output Name Parameters
        • 5.4.3.6.1 Query Output Names
        • 5.4.3.6.2 Update Output Names
      • 5.4.3.7 Type of Output Parameters
        • 5.4.3.7.1 Query Output Type
        • 5.4.3.7.2 Update Output Type
    • 5.4.4 STATUS Commands
      • 5.4.4.1 Status Channel Command
      • 5.4.4.2 Status General Commands
    • 5.4.5 REMOTE Commands
      • 5.4.5.1 Remote Channel Action Commands
      • 5.4.5.2 Remote General Action Commands
    • 5.4.6 Negative Response Error Codes
  • 5.5 Sample Cygnus Commands
    • 5.5.1 Remote Communications Example — Updating a Channel’s Rate Parameter
• Chapter 6 Installation and Interfaces
  • 6.1 Location Guidelines
    • 6.1.1 Sensor Types
    • 6.1.2 Sensor Installation
    • 6.1.3 Control Unit Installation
  • 6.2 Avoiding Electrical Interference
    • 6.2.1 Verifying/Establishing Earth Ground
    • 6.2.2 Connections to Earth Ground
    • 6.2.3 Minimizing Noise Pickup From External Cabling
  • 6.3 Connecting the Controller
    • 6.3.1 Verifying the Correct Input Voltage
    • 6.3.2 Voltage Selection
    • 6.3.3 Routing XIU Cables
    • 6.3.4 Interface Cable Fabrication and Pin-Out
      • 6.3.4.1 Source Control Connection
      • 6.3.4.2 Input/Relay Module Connections
      • 6.3.4.3 RS-232C Communications
      • 6.3.4.4 Isolated +24 V(dc) Supply
      • 6.3.4.5 Optional DAC Card
• Chapter 7 Calibration Procedures
  • 7.1 Importance of Density, Tooling and ZRatio
  • 7.2 Determining Density
  • 7.3 Determining Tooling
  • 7.4 Laboratory Determination of Z-Ratio
  • 7.5 Determining Cross Sensitivity Correction For Co-Deposition
    • 7.5.1 Procedure Overview
    • 7.5.2 Procedure Assumptions and Requirements
    • 7.5.3 Detailed Procedure
• Chapter 8 Troubleshooting, Status and Error Messages
  • 8.1 Status and Error Messages
  • 8.2 Troubleshooting Guide
    • 8.2.1 Major Instrument Components and Assemblies
    • 8.2.2 Troubleshooting the Instrument
    • 8.2.3 Troubleshooting Transducers/Sensors
    • 8.2.4 Troubleshooting Computer Communications
  • 8.3 Replacing the Crystal
    • 8.3.1 Standard and Compact
    • 8.3.2 Shuttered and Dual Sensors
    • 8.3.3 Bakeable Sensor
    • 8.3.4 Sputtering Sensor
    • 8.3.5 Crystal Snatcher
    • 8.3.6 CrystalSix
    • 8.3.7 Crystal12
  • 8.4 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2
    • 8.4.1 Diagnostic Procedures
      • 8.4.1.1 Measurement System Diagnostic Procedure
      • 8.4.1.2 Feed-Through Or In-Vacuum Cable Diagnostic Procedure
      • 8.4.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure
      • 8.4.1.4 System Diagnostics Pass But Crystal Fail Message Remains
    • 8.4.2 % XTAL Life
    • 8.4.3 Sensor Cover Connection
      • 8.4.3.1 Compatible Sensor Heads
      • 8.4.3.2 Incompatible Sensor Heads
    • 8.4.4 Specifications
• Chapter 9 Measurement and Control Theory
  • 9.1 Basics
    • 9.1.1 Monitor Crystals
    • 9.1.2 Period Measurement Technique
    • 9.1.3 Z-Match Technique
    • 9.1.4 Active Oscillator
    • 9.1.5 ModeLock Oscillator
    • 9.1.6 Auto Z-Match Theory
    • 9.1.7 Control Loop Theory
• Appendix A Material Table
• Index
  • A
    • acoustic impedance 9-9
    • action definitions 4-14
    • active oscillator 9-6, 9-8
    • aerial mass density 9-10
    • aggregate
    • anharmonic 9-2, 9-7, 9-9
    • AT
    • Auto Z-Match 9-9
    • Auto-Z 3-7, 3-11, 7-1, 7-3
    • averaging time 3-6
  • C
    • cable noise 6-7
    • calibration 7-3
    • channel display 2-12
    • channel parameters 3-12, 5-10
    • communication
    • components and assemblies 8-9
    • control
    • control unit installation 6-5
    • controller
    • counters 4-16
    • cross sensitivity correction 7-4
    • cross talk percent 3-11, 7-4
    • CRT screen 2-1
    • crystal 9-2
    • crystal replacement 8-20
    • crystal switch 2-24
    • CrystalSix 8-24
    • Customer Service 1-6
    • Customer Support
  • D
    • DAC 6-10
    • data entry 2-1
    • datalog 2-30
    • Declaration Of Contamination 1-6
    • density 7-1
    • density determination 7-1
    • deviation 3-7
    • displays 2-4
    • DTE 6-13
    • DTR/DSR 5-2
  • E
    • earth ground 1-4, 6-5
    • electrical interference 6-5
    • electrode-to-quartz bond 9-3
    • electromagnetic interference 6-10
    • error code 5-37
    • error command 5-37
    • evaporation source. 9-11
  • F
    • film-induced stress 9-11
    • fit, weighted least-square-exponential 9-12
    • floppy disk 2-29, 4-19
    • Frequency Response Method 9-11
    • function keys 2-1
    • fundamental 9-7, 9-8, 9-9
  • G
    • general parameters 5-16
    • ground 1-4
  • H
    • hand-held controller 2-28
    • hello command 5-8
    • host/server 5-1
  • I
    • I/O map 4-17
    • IAE 9-14
    • idle ramp 3-6
    • IEEE488 5-1, 5-3
    • input name parameters 5-18
    • Input/Relay module connection 6-11
    • installation location 6-1
    • integral time 9-13
    • interface cable fabrication 6-10
    • ISE 9-14
    • ITAE 9-14
  • L
    • Laplace transform 9-12
    • lock code 2-30
    • logic
  • M
    • main power connection 1-5
    • mass sensitivity 9-1
    • material table A-1
    • measured deposition rate 9-13
    • message
    • message format 5-4
    • mode hopping 9-7
    • ModeLock oscillator 9-7, 9-9
    • multiple layer deposition 7-4
  • N
    • negative response error code 5-37
    • noise from cables 6-7
  • O
    • Open Loop Method 9-11
    • output name parameters 5-23
    • output parameter type 5-24
  • P
    • parameter
    • period measurement 9-4
    • PID 3-3, 9-11, 9-13
    • power 9-13
    • power supply, isolated 6-14
    • precondition 3-4
    • process
    • pulse accumulator 9-4
  • Q
    • QCM 9-1
    • quality rate control 9-5
    • quartz crystal 9-1, 9-15
    • quasiharmonic 9-2, 9-9
    • query
  • R
    • rate
    • RateWatcher 3-9
    • reference oscillator 9-4
    • remote
    • Repair Service 1-6
    • resonance 9-6
    • rotary sensor 2-25
    • RS-232C 5-1, 5-37, 6-13
    • RTS/CTS 5-2
  • S
    • safety 1-2
    • Sales and Customer Service 1-6
    • secondary tooling 3-3
    • sensor
    • serial communication 6-13
    • series resonance 9-8
    • Service Center 1-6
    • source control connection 6-10
    • source/crucible selection 2-26
    • spattering 6-4
    • specifications 1-7
    • spreadsheet program 2-32
    • spurious shift 9-10
    • state descriptions 2-23
    • status code 5-24
  • T
    • Technical Support 1-6
    • test mode 2-29
    • thickness
    • timers 4-16
    • tooling 7-1, 7-2
    • tooling determination 7-2
    • troubleshooting 8-8
    • turret source crucible selection 2-26
  • U
    • update
  • V
    • voltage
  • W
    • windup 9-14
  • X
    • XIU cable routing 6-10
  • Z
    • Z-Match 9-5
    • Z-Match equation 9-5
    • Z-Ratio 7-1, 7-3, 9-9