Rockwell Automation 2093-xxxx Kinetix 2000 Multi-axis Servo Drive User Manual - Manual (Page 72)

Publication 2093-UM001A-EN-P — January 2007
72 Connecting the Kinetix 2000 Drive System
Grounding Multiple Subpanels
Extending the chassis ground to multiple subpanels is illustrated in the figure
below. High-frequency (HF) bonding is not illustrated.
Subpanels Connected to a Single Ground Point
For HF bonding information, refer to Bonding Modules on page 26.
Follow NEC and
applicable local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground