INFICON MDC-370 Thin Film Deposition Controller User Manual

Page 7

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8.1

MOUNTING ...................................................................................................................8-1

8.2

PROPER

GROUNDING .................................................................................................8-1

8.3

EXTERNAL

CONNECTIONS .......................................................................................8-1

8.3.1

POWER .......................................................................................................................8-1

8.3.2

VOLTAGE SELECTION .............................................................................................8-1

8.3.3

GROUND LUG ...........................................................................................................8-2

8.3.4

REMOTE POWER HANDSET ....................................................................................8-2

8.3.5

SOURCE-SENSOR .....................................................................................................8-2

8.3.6

RS-232 COMMUNICATION .......................................................................................8-2

8.3.7

DISCRETE INPUT/OUTPUT .....................................................................................8-3

8.3.8

DIGITAL-TO-ANALOG CONVERTER (DAC) ...........................................................8-3

9.

SYSTEM INSTALLATION ..............................................................................................9-1

9.1

SENSOR

HEAD

DESCRIPTION ...................................................................................9-1

9.2

SENSOR

HEAD

INSTALLATION ................................................................................9-1

9.3

SENSOR

OSCILLATOR ................................................................................................9-2

9.3.1

INSTALLATION ..........................................................................................................9-3

9.4

INSTRUMENTATION

FEEDTHROUGH .....................................................................9-3

9.5

SENSOR

CRYSTAL

REPLACEMENT .........................................................................9-3

9.6

TYPICAL

SYSTEM

INSTALLATION ..........................................................................9-4

10.

THEORY OF OPERATION ......................................................................................10-1

10.1

BASIC

MEASUREMENT ............................................................................................10-1

10.2

FILM

THICKNESS

CALCULATION ..........................................................................10-1

10.3

CRYSTAL

HEALTH

CALCULATION .......................................................................10-3

10.4

RATE

CALCULATION ................................................................................................10-4

10.5

M

ULTI

-

SENSOR AVERAGING

...........................................................................................10-4

10.6

EMPIRICAL

CALIBRATION ......................................................................................10-5

10.6.1

FILM DENSITY ....................................................................................................10-5

10.6.2

TOOLING FACTOR .............................................................................................10-6

10.6.3

ACOUSTIC IMPEDANCE ...................................................................................10-6

11.

COMPUTER INTERFACE ........................................................................................11-1

11.1

GENERAL .....................................................................................................................11-1

11.2

RS-232

SERIAL

INTERFACE ......................................................................................11-1

11.3

RS-485

SERIAL

INTERFACE ......................................................................................11-1

11.4

IEEE-488

PARALLEL

INTERFACE............................................................................11-2

11.5

PROTOCOL ..................................................................................................................11-2

11.6

DATA

TYPES ...............................................................................................................11-3

11.7

MESSAGE

RECEIVED

STATUS ................................................................................11-3

11.8

INSTRUCTION

SUMMARY .......................................................................................11-4

11.9

INSTRUCTION

DESCRIPTIONS ................................................................................11-5

12.

REPAIR AND MAINTENANCE ...............................................................................12-1

12.1

HANDLING

PRECAUTIONS ......................................................................................12-1

12.2

MAINTENANCE

PHILOSOPHY ................................................................................12-1

12.3

TROUBLE

SHOOTING

AIDS ......................................................................................12-2

12.4

RETURNING

THE

MDC-370

TO

THE

FACTORY .....................................................12-3

13.

APPENDIX A ...............................................................................................................13-1

14.

APPENDIX B – PARAMETER TEMPLATES ........................................................14-1

14.1

MATERIAL ...................................................................................................................14-2

14.2

PROCESS ......................................................................................................................14-4

14.3

DISPLAY

SETUP .........................................................................................................14-5

14.4

INPUTS .........................................................................................................................14-6

14.5

OUTPUTS .....................................................................................................................14-7

vii

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