INFICON IC6 Thin Film Deposition Controller User Manual

Page 290

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IC6 Operating Manual

NOTE: A more detailed troubleshooting guide is shipped with the sensor. Refer to

that manual for more detailed information in some cases

.

Table 15-8 Troubleshooting Transducers/Sensors

SYMPTOM

CAUSE

REMEDY

1. Large jumps of thickness
reading during deposition

a. Mode hopping due to
defective crystal

a. Replace crystal, use
ModeLock™ measurement
system

b. Stress causes film to peel
from crystal surface

b. Replace crystal or use high
performance RunSaver™
crystal; consult factory

c. Particulate or "spatter" from
molten source striking crystal

c. Thermally condition the
source thoroughly before
deposition, use a shutter to
protect the crystal during source
conditioning

d. Scratches or foreign particles
on the crystal holder seating
surface (improper crystal
seating)

d. Clean and polish the crystal
seating surface on the crystal
holder

e. Small pieces of material fell
on crystal (for crystal facing up
sputtering situation)

e. Check the crystal surface and
blow it off with clean air

f. Small pieces of magnetic
material being attracted by the
sensor magnet and contacting
the crystal (sputtering sensor
head)

f. Check the sensor cover's
aperture and remove any foreign
material that may be restricting
full crystal coverage

2. Crystal ceases to oscillate
during deposition before it
reaches the end its normal life

a. Crystal struck by particulate or
spatter from molten source

a. Thermally condition the
source thoroughly before
deposition, use a shutter to
protect the crystal during source
conditioning

b. Material on crystal holder
partially masking crystal cover
aperture

b. Clean crystal holder

c. Existence of electrical short or
open condition

c.Using an ohm meter or DVM,
check for electrical continuity in
the sensor cable, connector,
contact springs, connecting wire
inside sensor, and feedthroughs

d. Check for thermally induced
electrical short or open condition

d. See C above

NOTE: Crystal life is highly dependent on process conditions of rate, power radiated from source,
location, material, and residual gas composition.

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