Document Outline

• Cover Page
• Title Page
• Trademarks
• Disclaimer
• Copyright
• Declaration Of Conformity
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Introduction
    • 1.1.1 Related Manuals
  • 1.2 IC6 Safety
    • 1.2.1 Definition of Notes, Cautions and Warnings
    • 1.2.2 General Safety Information
    • 1.2.3 Earth Ground
    • 1.2.4 Main Power Connection
  • 1.3 How To Contact INFICON
    • 1.3.1 Returning Your IC6
  • 1.4 IC6 Specifications
    • 1.4.1 Measurement
    • 1.4.2 Screens and Hierarchy
    • 1.4.3 IC6 Features
      • 1.4.3.1 Recipe Storage & Datalogging
      • 1.4.3.2 Sensor Parameters
      • 1.4.3.3 Source Parameters
      • 1.4.3.4 Material Parameters
      • 1.4.3.5 Process Layer Parameters
      • 1.4.3.6 General Global Parameters
    • 1.4.4 Display
    • 1.4.5 DAC Outputs
    • 1.4.6 Logic Processing
    • 1.4.7 Relays / Inputs
    • 1.4.8 Remote Communications
    • 1.4.9 Accessories
    • 1.4.10 Power
    • 1.4.11 Operating Environment
    • 1.4.12 Storage Temperature
    • 1.4.13 Warm Up Period
    • 1.4.14 Size
    • 1.4.15 Installation Clearance Requirements
      • 1.4.15.1 Connector Clearance
      • 1.4.15.2 Cooling Clearance
    • 1.4.16 Weight
    • 1.4.17 Cleaning
  • 1.5 Unpacking and Inspection
  • 1.6 Parts and Options Overview
    • 1.6.1 Base Configurations
    • 1.6.2 Pre-installed Options or Spares
    • 1.6.3 Optional Accessories
    • 1.6.4 Oscillator Packages
    • 1.6.5 Sensors
    • 1.6.6 Replacement Cables
  • 1.7 Initial Power-On Verification
• Chapter 2 Installation and Interfaces
  • 2.1 Location Guidelines
    • 2.1.1 Sensor Types
    • 2.1.2 Sensor Installation
    • 2.1.3 IC6 Installation
  • 2.2 Avoiding Electrical Interference
    • 2.2.1 Verifying/Establishing Earth Ground
    • 2.2.2 Connections to Earth Ground
    • 2.2.3 Minimizing Noise Pickup From External Cabling
  • 2.3 Connecting the Controller
    • 2.3.1 Routing XIU Cables
    • 2.3.2 Interface Cable Fabrication and Pin-Out
      • 2.3.2.1 Source Control Connection
      • 2.3.2.2 Crucible Indexer Connections
      • 2.3.2.3 DAC Option Kit 781-504-G1
      • 2.3.2.4 I/O Expansion Options
      • 2.3.2.5 RS-232C Communications
      • 2.3.2.6 Isolated +24 V (dc) Supply
• Chapter 3 Operation
  • 3.1 Front Panel Controls
  • 3.2 Rear Panel Interfaces
  • 3.3 Displays
    • 3.3.1 Main Menu Display
    • 3.3.2 Operate
    • 3.3.3 Sensor Information
      • 3.3.3.1 Sensor Information Rate/Xtal Display Description
      • 3.3.3.2 Crystal Life and Starting Frequency
      • 3.3.3.3 Percent Life Auto-Zero
        • 3.3.3.3.1 Function Key Selection Choices for the Sensor Information Rate/Xtal Display
      • 3.3.3.4 Sensor Information Type/Freq Display Description
        • 3.3.3.4.1 TEST XIU
    • 3.3.4 Sensor Screen
    • 3.3.5 Source
    • 3.3.6 Material
      • 3.3.6.1 Overview Page
      • 3.3.6.2 Source Page
      • 3.3.6.3 Sensor Page
      • 3.3.6.4 Pre/Post Page
      • 3.3.6.5 Deposit Page
      • 3.3.6.6 Lib A-Hf, Lib Hf-Sc, Lib Sc-Z Sub-Displays
    • 3.3.7 Process
      • 3.3.7.1 Overview Page
      • 3.3.7.2 Current Process
      • 3.3.7.3 1 - 10, 11 - 20 etc. Screen
    • 3.3.8 General
      • 3.3.8.1 Process Page
      • 3.3.8.2 DACs Page
      • 3.3.8.3 Comm Page
      • 3.3.8.4 Message Page
      • 3.3.8.5 Date/Time Page
      • 3.3.8.6 Test Page
      • 3.3.8.7 Lock Page
      • 3.3.8.8 Audio/Visual Page
    • 3.3.9 Digital I/O
    • 3.3.10 Logic
    • 3.3.11 Maintenance
    • 3.3.12 Counter / Timer
    • 3.3.13 USB Storage
  • 3.4 Process Description
    • 3.4.1 Defining a Process
    • 3.4.2 Executing a Process
    • 3.4.3 Pre-conditioning a Layer
    • 3.4.4 Co-deposition
    • 3.4.5 Multiple Layer Starts
    • 3.4.6 Automating a Process
  • 3.5 State Descriptions
  • 3.6 Special Features
    • 3.6.1 Crystal Switching
      • 3.6.1.1 XtalTwo (CrystalTwo)
      • 3.6.1.2 XtalSix (CrystalSix)
      • 3.6.1.3 Xtal12 (Crystal12)
      • 3.6.1.4 Generic Sensor Crystal Switching
    • 3.6.2 Source/Crucible Selection
      • 3.6.2.1 Example: Programming Turret Source Crucible Selection
    • 3.6.3 Auto-Z
    • 3.6.4 Auto Tune — Optimizing the Control Loop
    • 3.6.5 Rate Watcher
    • 3.6.6 Handheld Controller
      • 3.6.6.1 Determining Soak Power with the Handheld Controller
    • 3.6.7 Test Mode
      • 3.6.7.1 Standard or Time Compressed
      • 3.6.7.2 Advanced Test
    • 3.6.8 USB Storage Device
    • 3.6.9 Lock and Access Codes
    • 3.6.10 Datalog
    • 3.6.11 DAC Monitoring
• Chapter 4 Sensor & Source Setup
  • 4.1 Sensor Setup Introduction
    • 4.1.1 Sensor Display Navigation
    • 4.1.2 Sensor Parameters
  • 4.2 Source Setup Introduction
    • 4.2.1 Source Navigation
    • 4.2.2 Source Parameters
  • 4.3 DAC Output Selection Rules
• Chapter 5 Material Setup
  • 5.1 Introduction
    • 5.1.1 Material Screen Overview Page
    • 5.1.2 Material Definition
    • 5.1.3 Material Screen Source Page Parameters
    • 5.1.4 Material Screen Sensor Parameters Page
    • 5.1.5 Pre/Post Screen Deposit Page Parameters
    • 5.1.6 Post Deposit Parameters
    • 5.1.7 Deposit Page Parameters
• Chapter 6 Process Setup
  • 6.1 Process Setup Introduction
  • 6.2 Overview Page
  • 6.3 Curr(ent) Proc(ess) Page
  • 6.4 Process Layers 1 - 10 etc.
    • 6.4.1 Layer Parameters
      • 6.4.1.1 Layer Parameter Editing
      • 6.4.1.2 Layer Parameters
  • 6.5 Special Layer Parameter Features
    • 6.5.1 Skip Deposit
• Chapter 7 General Parameters
  • 7.1 General Setup Overview
  • 7.2 General Screen Process Page
  • 7.3 DACs Page Parameters
  • 7.4 COMM Page Parameters
  • 7.5 MESSAGE Page Setup
  • 7.6 DATE / TIME Set Up
  • 7.7 TEST Page Set Up
  • 7.8 LOCK Page Code Setup
  • 7.9 AUDIO / VISUAL Page Set Up
• Chapter 8 Digital I/O
  • 8.1 Digital I/O Screen
  • 8.2 All Input Page
  • 8.3 All Output Page
  • 8.4 I/O Board Page
    • 8.4.1 Output Type
• Chapter 9 Logic Statement Setup
  • 9.1 Logic Statement Overview
  • 9.2 Editing the Logic Statements
    • 9.2.1 Logic Statement Groups
    • 9.2.2 Logic Statement Editing
    • 9.2.3 AND/OR and ON Logic Connectors
      • 9.2.3.1 ON Operator
  • 9.3 IF Event Definitions
  • 9.4 THEN Action Definitions
  • 9.5 Logic Statement Example
• Chapter 10 Remote Communications
  • 10.1 Remote Communication Configuration Overview
  • 10.2 Physical Connections
    • 10.2.1 RS-232C Serial Port
    • 10.2.2 TCP/IP Ethernet Port
      • 10.2.2.1 Network Connection
      • 10.2.2.2 How to Set Up the Network Protocol on the PC
  • 10.3 Message Format
    • 10.3.1 Protocol
      • 10.3.1.1 Command Packet (Host to IC6 Message)
      • 10.3.1.2 Response Packet (IC6 to Host Message)
      • 10.3.1.3 Timeouts
    • 10.3.2 Data Type Codes
      • 10.3.2.1 REAL_xXx and REAL_xFx
      • 10.3.2.2 TIME
      • 10.3.2.3 ENCODE
      • 10.3.2.4 INTEGER
      • 10.3.2.5 LOCKCODE
  • 10.4 Communication Commands
    • 10.4.1 Query and Update Commands
    • 10.4.2 Status Commands
    • 10.4.3 HELLO Command
    • 10.4.4 Query Source Parameter
    • 10.4.5 Update Source Parameter
    • 10.4.6 Query General Parameter
    • 10.4.7 Update General Parameter
    • 10.4.8 Query Input Name
    • 10.4.9 Update Input Name
    • 10.4.10 Query Process Name
    • 10.4.11 Update Process Name
    • 10.4.12 Query Logic Statement
    • 10.4.13 Update Logic Statement
    • 10.4.14 IC6 Event List
    • 10.4.15 IC6 Action List
    • 10.4.16 Query Material Parameter
    • 10.4.17 Update Material Parameter
    • 10.4.18 Query Material Name
    • 10.4.19 Update Material Name
    • 10.4.20 Query Output Name
    • 10.4.21 Update Output Name
    • 10.4.22 Query Process Layer Parameter
    • 10.4.23 Update Process Layer Parameter
    • 10.4.24 Query Sensor Parameter
    • 10.4.25 Update Sensor Parameter
    • 10.4.26 Query Output Type
    • 10.4.27 Update Output Type
    • 10.4.28 Query User Message
    • 10.4.29 Update User Message
    • 10.4.30 Status General
    • 10.4.31 Status Layer
    • 10.4.32 Status Sensor
    • 10.4.33 Remote General Action
    • 10.4.34 Remote Layer Action
    • 10.4.35 IC6 Communications Examples
      • 10.4.35.1 General Command Packet Format
      • 10.4.35.2 General Response Packet Format
      • 10.4.35.3 HELLO Command, ASCII name and version
      • 10.4.35.4 Query General Parameter
      • 10.4.35.5 Update General Parameter
      • 10.4.35.6 Query Material Parameter
      • 10.4.35.7 Update Material Parameter
      • 10.4.35.8 Query Sensor Parameter
      • 10.4.35.9 Update Sensor Parameter
      • 10.4.35.10 Query Source Parameter
      • 10.4.35.11 Update Source Parameter
      • 10.4.35.12 Query Process Layer Parameter
      • 10.4.35.13 Update Process Layer Parameter
      • 10.4.35.14 Query Material Name
      • 10.4.35.15 Update Material Name
      • 10.4.35.16 Query Process Name
      • 10.4.35.17 Update Process Name
      • 10.4.35.18 Query Input Name
      • 10.4.35.19 Update Input Name
      • 10.4.35.20 Query Output Name
      • 10.4.35.21 Update Output Name
      • 10.4.35.22 Query Output Type
      • 10.4.35.23 Update Output Type
      • 10.4.35.24 Query User Message
      • 10.4.35.25 Update User Message
      • 10.4.35.26 Query Logic Statement
      • 10.4.35.27 Update Logic Statement
      • 10.4.35.28 Status General
      • 10.4.35.29 Status Layer
      • 10.4.35.30 Status Sensor
      • 10.4.35.31 Remote General Action
      • 10.4.35.32 Remote Layer Action
      • 10.4.35.33 Example for Interpreting Float Responses
• Chapter 11 Applications
  • 11.1 Multiple Sensor Deposition Control
    • 11.1.1 IC6 Parameters and Corrections for Multiple Sensor Operation
  • 11.2 Trend Analysis
    • 11.2.1 IC6 Parameters Associated with the Trend Analysis Feature
  • 11.3 IC6 Cygnus Emulation
  • 11.4 IC6 Four & Six Layer (Cygnus Emulation) Configuration
    • 11.4.1 Configure Sensors 1 to 6
    • 11.4.2 Configure Sources 1 to 6
    • 11.4.3 Configure six Materials
    • 11.4.4 Configure the Process
    • 11.4.5 General Parameters
    • 11.4.6 Logic Functions Table
    • 11.4.7 State Descriptions
      • 11.4.7.1 NonDepCntl State
      • 11.4.7.2 Suspend
      • 11.4.7.3 Idle
• Chapter 12 Maintenance and Calibration Procedures
  • 12.1 Importance of Density, Tooling and Z-Ratio
  • 12.2 Determining Density
  • 12.3 Determining Tooling
  • 12.4 Laboratory Determination of Z-Ratio
  • 12.5 AutoTuning
    • 12.5.1 AutoTune Preparation Instructions
    • 12.5.2 AutoTune Parameters
    • 12.5.3 AutoTune Manual Display
    • 12.5.4 AutoTune Tuning Display
    • 12.5.5 AutoTune Description
  • 12.6 Determining Cross Talk Calibration For Co-Deposition
    • 12.6.1 Procedure Set-Up
      • 12.6.1.1 Cross Talk Calibration Procedural Notes
      • 12.6.1.2 Cross Talk Calibrate Parameters
    • 12.6.2 Cross Talk Calibration MANUAL display
      • 12.6.2.1 Function Key Selection Choices
    • 12.6.3 Cross Talk Calibration CALIBRATE display
    • 12.6.4 Cross Talk Calibration SELECT display
      • 12.6.4.1 Function Key Selection Choices for Cross Talk Calibration Select
  • 12.7 Source Maintenance
    • 12.7.1 Source Maintenance Parameters
      • 12.7.1.1 Crucible Rotation
      • 12.7.1.2 Toggle Sensor and Source Shutter
      • 12.7.1.3 Start/Stop Manual Power
  • 12.8 System Status
• Chapter 13 Counters & Timers
  • 13.1 Introduction
• Chapter 14 USB Storage
  • 14.1 File Handling (USB)
    • 14.1.1 USB Storage Devices
  • 14.2 Directory Structure
  • 14.3 Configuration Files
  • 14.4 Data Logs
  • 14.5 Screen Captures
• Chapter 15 Troubleshooting, Status and Error Messages
  • 15.1 Status Messages
  • 15.2 User Messages
  • 15.3 AutoTune and Calibration Messages
  • 15.4 STOP messages
  • 15.5 Transient Messages
  • 15.6 Input Error Messages
  • 15.7 Troubleshooting Guide
    • 15.7.1 Troubleshooting the IC6
    • 15.7.2 Troubleshooting Transducers/Sensors
    • 15.7.3 Troubleshooting Computer Communications
  • 15.8 Replacing the Crystal
    • 15.8.1 Front Load
    • 15.8.2 Cool Drawer
    • 15.8.3 Shuttered and Dual Sensors
    • 15.8.4 Bakeable Sensor
    • 15.8.5 Sputtering Sensor
    • 15.8.6 Crystal Snatcher
    • 15.8.7 CrystalSix (XtalSix)
  • 15.9 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2
    • 15.9.1 Diagnostic Procedures
      • 15.9.1.1 Measurement System Diagnostic Procedure
      • 15.9.1.2 Feedthrough Or In-Vacuum Cable Diagnostic Procedure
      • 15.9.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure
      • 15.9.1.4 System Diagnostics Pass But Crystal Fail Message Remains
    • 15.9.2 % XTAL Life
    • 15.9.3 Sensor Cover Connection
      • 15.9.3.1 Compatible Sensor Heads
      • 15.9.3.2 Incompatible Sensor Heads
    • 15.9.4 Specifications
• Chapter 16 Measurement and Control Theory
  • 16.1 Basics
    • 16.1.1 Monitor Crystals
    • 16.1.2 Period Measurement Technique
    • 16.1.3 Z-match Technique
    • 16.1.4 Active Oscillator
    • 16.1.5 ModeLock Oscillator
    • 16.1.6 Auto-Z Theory
    • 16.1.7 Control Loop Theory
• Appendix A Material Table
  • A.1 Introduction