INFICON STC-2000A Thin Film Deposition Controller Operating Manual User Manual

Page 42

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STC-2000A DEPOSITION CONTROLLER

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When the STC-2000A sensor card control voltage output is connected to the evaporant power supply,
Review Source Sensor Map parameters need to be selected for a proper interface (

SOURCE OUT CHaNneL,

SOURCE FULL PoWeR, SOURCE MAX PoWeR

) and the Map itself needs to be selected by a Film parameter

(SS MAP SELECT). Following this, other power supply related parameters must also be contemplated.
Some thermal excitation alternatives include: electron beam: wire fed electron beam source, high vacuum
e-beam w/ small (~2cc) crucible, fixed pocket (large and small), rotary pocket indexers; resistive heater
sources: metal filament boats, coils, oxide crucibles (all for organic material deposition). Crucible
capacities can range from a fraction of a cc to over 500cc. The input control requirements of the high
current (or voltage) power supply should be found in the power supply documentation. Don't assume there
is a standard. With the STC-2000A control voltage output controlling the power supply for the thermal
sources described above (the 2

nd

control output voltage used for power supply control is typically employed

for the recorder function), the film parameters effecting power (processes depend upon films) are:

Soak 1 Power level Value

0.0 to 100.0%

Power Ramp 1 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 1 Time (@ pwr level) 0 to 99:59 MM:SS
Soak 2 Power level Value

0.0 to 100.0%

Power Ramp 2 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 2 Time (@ pwr level) 0 to 99:59 MM:SS
Soak 3 Power level Value

0.0 to 100.0%

Power Ramp 3 Time (to pwr level) 0 to 99:59 MM:SS
Control Loop –P-roportional term 1 to 9999
Control Loop –I-ntegral term

0.0 to 99.9 sec

Control Loop –D-erivative term

0.0 to 99.9 sec

Max Power Limit

0.0 to 100.0%

These parameters are presented
here for the purpose of name
familiarization and categorization
of power related parameters
across menu and screen
boundaries.

Abort Max Power SW

OFF/ON

Max Power Dwell

0:01-99:59 MM:SS

Control Loop Qual Limits

0 to 9

Plot Vert Scale Volts

1, 5, 10, 50, 100

⇐ Graphical display function

Plot Horiz Scale H

1 to 600 samples

⇐ Graphical display function

Data Plot Type

Rate /Power /Rate Deviation

⇐ Graphical display function

Source Sensor Map Select

1 to 10

(Selects the Map that contains Source Sensor analog output parameters)

Etching Mode

Off / On (

Rate Direction can be Positive or Negative)


The Power Related RunTime Screen parameters are:
(Crystal Quality Indicator Select) L/Q, Loop x, Qual xx
(Manual mode)

(fixed front panel key)

(Manual mode)

(pendant arrow keys [increase / decrease power manually])

(Manual

mode)

(2

nd

STATUS screen arrows:

[increase/decrease power manually])

(Manual

mode)

(2

nd

STATUS screen: zero power key [LCD] on non-active channels)

(Manual mode)

(3

rd

STATUS screen: zero thick key [LCD] no effect on material thickness)

(Manual

mode)

(3

rd

STATUS screen: force fail key [LCD] fail/verify crystal channels)

The Power Related System Configuration values are:

Menu path: Main/Executive menu/System Configuration]

Recorder Functions

Rate, Rate Deviation, Power, Thickness, Computer Remote, I/O, Off

Recorder Analog Output ChaNneL

2 Channels (select 1 only)

[note possible conflict w/ Source Analog Output]


The Power Related Review Source Sensor Map values are:

Menu path: Main/Review SS Map]

Source FS Voltage Scaling PoWeR*

2.5/5/10 Full Scale VOLTS

see Power Supply input requirement

Source Max PoWeR

0.0 – 100.0%

Source Analog Output CHaNneL

2 Channels (select 1 only)


The Power Related Service Menu values are:

Menu path: Main/Service]

(Memory Contents)

as is (no modification), purged, factory (defaults) [see section 3.21 ]

note

film

parameter

changes

(Reset)

Arm reset, reset armed [Provide a product reset when back panel power

SECTION 2.XX

page 42 of 292

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