INFICON STC-2000A Thin Film Deposition Controller Operating Manual - Manual (Page 65)

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STC-2000A DEPOSITION CONTROLLER
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Area # 4: Miscellaneous
4. Miscellaneous Area. This has several pieces of data in it. These are:
FILM - Shows film program that you are currently running (1 of 50).
SRC # - Indicates the Source Sensor Analog Output voltage channel. An SRC of zero
indicates that a source analog output control voltage has been assigned to a source sensor
card that is not present, not working, etc.
XTAL 1 and 2 - Shows which sensors are currently active or standby. Active crystals
are indicated by their numeric name. Standby crystals are indicated by their numeric
name alternating on the screen with a dash at a ~1Hz. rate. Percentage of potential crystal
life left can be viewed by pressing the STATUS key twice. When a new sensing crystal is
installed it will indicate 99 to 95% of crystal life remaining. A sensing crystal will show
0% remaining when the mass deposited on the surface of the crystal has caused the
sensing crystal to shift by 1 MHz. About 500,000 KÅ of aluminum causes a frequency
shift of 1 MHz. Depending on the material being deposited, a sensor may fail
considerably before showing 0% remaining life. This is due mainly to the high film
stress generated by some materials or other characteristics of the deposition material
which causes the sensing crystal and circuit to cease oscillation prior to the full MHz shift
generally possible with deposition materials such as Al, or Cu .
MAP # - Each sensor has various parameters. A map is an associative list of these source
sensors with their parameters along with source power parameters, tooling, etc. This list
can structure the sequence of which crystals start active, which are backups, etc. A
unique map can be identified by its map number. Only one map can be active at a time.
A Map is used when it is called out by the film parameter SS Map Select. A map can be
re-used (called by more than 1 film).
RUN TIME - Shows minutes and seconds into the film.
PHASE TIME - Shows minutes and seconds remaining in the current timed phase, or
elapsed for indefinite duration phases (such as DEPOSIT).
RUN # - A user programmable number that increments at the start of every Process.
Area # 5: Process Status Line
5. Process Status Line - These two in-line text boxes running horizontally in the top left section
of the screen indicate: the process being used, the current layer number, and the process
status when the unit is configured for SEQuencing (non-SEQuencing configuration
blanks these 3 boxes). The process status has one of the five following messages
displayed:
a) PROCESS STOP - This message is displayed when the last layer of the process has been
completed or the process has been reset (by using the (START-Reset/Start Proc) from a
PROCESS RESTING. A process must be in this state to start a process from layer 1.
b) PROCESS WAITING- This message displayed when a WAIT has been encountered in
the layer sequence. A (START-Break Wait) or a programmed I/O input can release the
wait. (START-Reset/Start Proc) takes the process to RESTING.
c) PROCESS RESTING - This message occurs during the reset (START- Reset/Start Proc)
of a PROCESS ERROR or PROCESS WAIT condition. While in this condition the user
can reset (START-Reset/Start Proc) to PROCESS STOP, Restart the current layer
(START-Restart Film) or start the next layer (START-Next Layer). These options allow
the user to select the error recovery method.
d) PROCESS BUSY - This message occurs during an operation phase of a deposition
process.
e) ERROR IN RECIPE - This message occurs when a process is started which has no layer
information programmed.
f) ERROR-FILM ABORT - This message occurs when an abnormal event occurs during
the running of a film. Anything which stops or aborts a film program causes this message
to occur (i.e. crystal failure, max. power abort, Front Panel STOP key, power loss, etc.).
A reset (START- Reset/Start Proc) takes the process to the PROCESS RESTING phase
where the user can select the path of error recovery desired.
SECTION 3.XX page 65 of 292