Motorola MPC8260 User Manual

Page 13

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MOTOROLA

Contents

xiii

CONTENTS

Paragraph
Number

Title

Page

Number

10.4.5

Bank Interleaving ........................................................................................10-36

10.4.5.1

SDRAM Address Multiplexing (SDAM and BSMA) .............................10-37

10.4.6

SDRAM Device-Specific Parameters ..........................................................10-38

10.4.6.1

Precharge-to-Activate Interval .................................................................10-38

10.4.6.2

Activate to Read/Write Interval ...............................................................10-39

10.4.6.3

Column Address to First Data OutÑCAS Latency .................................10-40

10.4.6.4

Last Data Out to Precharge ......................................................................10-40

10.4.6.5

Last Data In to PrechargeÑWrite Recovery ...........................................10-41

10.4.6.6

Refresh Recovery Interval (RFRC)..........................................................10-41

10.4.6.7

External Address Multiplexing Signal .....................................................10-41

10.4.6.8

External Address and Command Buffers (BUFCMD) ............................10-42

10.4.7

SDRAM Interface Timing............................................................................10-42

10.4.8

SDRAM Read/Write Transactions...............................................................10-46

10.4.9

SDRAM Mode-Set Command Timing ........................................................10-46

10.4.10

SDRAM Refresh ..........................................................................................10-47

10.4.11

SDRAM Refresh Timing .............................................................................10-47

10.4.12

SDRAM Configuration Examples ...............................................................10-48

10.4.12.1

SDRAM Configuration Example (Page-Based Interleaving) ..................10-48

10.4.13

SDRAM Configuration Example (Bank-Based Interleaving) .....................10-50

10.5

General-Purpose Chip-Select Machine (GPCM) .............................................10-51

10.5.1

Timing Configuration...................................................................................10-52

10.5.1.1

Chip-Select Assertion Timing..................................................................10-53

10.5.1.2

Chip-Select and Write Enable Deassertion Timing .................................10-54

10.5.1.3

Relaxed Timing........................................................................................10-55

10.5.1.4

Output Enable (OE) Timing.....................................................................10-57

10.5.1.5

Programmable Wait State Configuration .................................................10-57

10.5.1.6

Extended Hold Time on Read Accesses ..................................................10-57

10.5.2

External Access Termination .......................................................................10-60

10.5.3

Boot Chip-Select Operation .........................................................................10-61

10.5.4

Differences between MPC8xxÕs GPCM and MPC8260Õs GPCM...............10-62

10.6

User-Programmable Machines (UPMs) ...........................................................10-62

10.6.1

Requests .......................................................................................................10-64

10.6.1.1

Memory Access Requests ........................................................................10-65

10.6.1.2

UPM Refresh Timer Requests .................................................................10-65

10.6.1.3

Software RequestsÑrun Command.........................................................10-66

10.6.1.4

Exception Requests ..................................................................................10-66

10.6.2

Programming the UPMs...............................................................................10-66

10.6.3

Clock Timing ...............................................................................................10-67

10.6.4

The RAM Array ...........................................................................................10-69

10.6.4.1

RAM Words .............................................................................................10-70

10.6.4.1.1

Chip-Select Signals (CxTx) .................................................................10-74

10.6.4.1.2

Byte-Select Signals (BxTx) .................................................................10-75

10.6.4.1.3

General-Purpose Signals (GxTx, GOx) ...............................................10-76

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