INFICON IC/5 Thin Film Deposition Controller User Manual

Page 212

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IC/5 Operating Manual

The I/O capability of the IC/5 can be used to control an entire vacuum deposition
system including pump down sequencing. The following discussion details the
implementation of an IC/5 to control the entire process cycle of a deposition
system. The discussion is divided into two sections. The first section is a list of
equipment used in this application, and is provided only as a reference to the type
of equipment required. The second section provides a detailed example listing the
I/O Configuration and Logic Statements used to control the vacuum deposition
system. These logic statements are one possible set of statements which will
control the system properly and are meant as a guideline only.

WARNING

Automated control of a vacuum deposition system must
provide for fail safe conditions to prevent personal injury
or damage to the vacuum system. These fail safe
conditions must account for power loss or inadvertent
manual actuation of valves, pumps, gauges or other
hardware connected to the system.

WARNING - Risk Of Electric Shock

Extreme care must be taken when applying power to the
electron beam gun or other high voltage equipment. Be
certain you do not provide power when inappropriate.
Death or personal injury may result.

WARNING

It is strongly recommended that you verify operation of
the system controller functions, including all valving and
I/O logic statements prior to applying power to the
vacuum system.

A block diagram of the example system configuration is shown in

Figure 10-2

. In

this figure, inputs to and outputs from the IC/5 are labeled with the mnemonics
shown on the I/0 Map Display for Board 1 and Board 2 in

section 10.3.2 on page

10-10

. Arrows pointing to the IC/5 indicate inputs to the IC/5. Arrows pointing away

from the IC/5 indicate output relay connections to the various system equipment.

NOTE: This example of the IC/5 automatically controlling the Pump Down,

Deposition, and Vent cycle does not contain automatic filling/refilling of the
Liquid Nitrogen cold trap. This example is for a single sensor, single source
deposition.

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