INFICON IC/5 Thin Film Deposition Controller - Manual (Page 283)

13 - 19
IP
N 07
4-
23
7A
E
IC/5 Operating Manual
6. poor thickness
reproducibility a. variable source flux
distribution a. move sensor to a more
central location to reliably
sample evaporant, ensure
constant relative pool
height of melt, avoid
tunneling into the melt
b. sweep, dither, or position
where the electron beam
strikes the melt has been
changed since the last
deposition b. maintain consistent
source distribution by
maintaining consistent
sweep frequencies, sweep
amplitude and electron
beam position settings
c. material does not adhere
to the crystal c. make certain the crystal
surface is clean; avoid
touching crystal with
fingers, make use of an
intermediate adhesion layer
d. cyclic change in rate d. make certain source's
sweep frequency is not
"beating" with the
instrument's measurement
frequency
7. large drift in thickness
(greater than 200 A for a
density of 5.00 g/cc) after
termination of sputtering a. crystal heating due to
poor thermal contact a. clean or polish the crystal
seating surface on the
crystal holder
b. external magnetic field
interfering with the sensor's
magnetic field (sputtering
sensor) b. rotate sensor magnet to
proper orientation with
external magnetic field,
refer to the sputtering
sensor manual IPN
074-157
c. sensor magnet cracked
or demagnetized
(sputtering sensor) c. check sensor magnetic
field strength, the maximum
field at the center of the
aperture should be 700
gauss or greater
Table 13-2 Troubleshooting Transducers/Sensors
SYMPTOM CAUSE REMEDY