Document Outline

• Cover Page
• Title Page
• Trademarks
• Declaration Of Conformity
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Introduction
    • 1.1.1 Related Manuals
  • 1.2 Instrument Safety
    • 1.2.1 Definition of Notes, Cautions and Warnings
    • 1.2.2 General Safety Information
    • 1.2.3 Earth Ground
    • 1.2.4 Main Power Connection
  • 1.3 How To Contact Customer Support
    • 1.3.1 Returning Your Instrument
  • 1.4 IC/5 Specifications
    • 1.4.1 Measurement
    • 1.4.2 Screens and Hierarchy
    • 1.4.3 SetUp Parameters
    • 1.4.4 Display
    • 1.4.5 Source / Recorder Outputs
    • 1.4.6 Logic Processing
    • 1.4.7 Relays / Inputs
    • 1.4.8 Remote Communications
    • 1.4.9 Accessories
    • 1.4.10 Power
    • 1.4.11 Operating Environment
    • 1.4.12 Storage Temperature
    • 1.4.13 Warm Up Period
    • 1.4.14 Size
    • 1.4.15 Connector Clearance Requirements
    • 1.4.16 Weight
    • 1.4.17 Cleaning
  • 1.5 Unpacking and Inspection
  • 1.6 Parts and Options Overview
    • 1.6.1 Base Configurations
    • 1.6.2 Preinstalled Options or Spares
    • 1.6.3 Optional Accessories
    • 1.6.4 Oscillator Packages and Sensors
  • 1.7 Initial PowerOn Verification
• Chapter 2 Measurement and Control Theory
  • 2.1 Basics
    • 2.1.1 Monitor Crystals
    • 2.1.2 Period Measurement Technique
    • 2.1.3 Z-match Technique
    • 2.1.4 Active Oscillator
    • 2.1.5 ModeLock Oscillator
    • 2.1.6 Auto Z-match Theory
    • 2.1.7 Control Loop Theory
• Chapter 3 Operation
  • 3.1 Front Panel Controls
  • 3.2 Rear Panel Interfaces
  • 3.3 Displays
    • 3.3.1 Display Navigation via the MENU TREE
    • 3.3.2 Operate Display
      • 3.3.2.1 Crystal Life and Starting Frequency
    • 3.3.3 Sensors Display
      • 3.3.3.1 SENSORS Display Description
      • 3.3.3.2 Function Key Selection Choices for the Sensors Display
    • 3.3.4 Maintenance/Diagnostics Display
      • 3.3.4.1 Function Key Selection Choices for the Maintenance/Diagnostics Display
    • 3.3.5 Source Maintenance Display
      • 3.3.5.1 Function Key Selection Choices for the Source Maintenance Display
    • 3.3.6 Cross Talk and Calibration Display
    • 3.3.7 Program Displays
      • 3.3.7.1 Function Key Selection Choices for the Program Display
  • 3.4 Process Description
    • 3.4.1 Defining a Process
    • 3.4.2 Executing a Process
    • 3.4.3 Pre-conditioning a Layer
    • 3.4.4 Co-deposition
    • 3.4.5 Automating a Process
  • 3.5 State Descriptions
  • 3.6 Special Features
    • 3.6.1 Crystal Switching
      • 3.6.1.1 CrystalSix Position Select
      • 3.6.1.2 Rotary Sensor Crystal Switching
    • 3.6.2 Source/Crucible Selection
      • 3.6.2.1 Example: Programming Turret Source Crucible Selection
    • 3.6.3 Auto Z
    • 3.6.4 Auto Tune - Optimizing the Control Loop
    • 3.6.5 Rate Watcher
    • 3.6.6 Hand-Held Controller
    • 3.6.7 Test Mode
    • 3.6.8 Floppy Disk (Optional)
    • 3.6.9 Lock and Access Codes
    • 3.6.10 Datalog
• Chapter 4 Material Set Up
  • 4.1 Material Set Up Overview
  • 4.2 Material Definition
  • 4.3 Material Definition Parameters
  • 4.4 Error Messages in Material Set-Up
• Chapter 5 Process Set-Up
  • 5.1 Process Set-Up Overview
  • 5.2 Process Definition
    • 5.2.1 Layer Editing
  • 5.3 Layer Definition Parameters
  • 5.4 Error Messages in Process Set-Up
  • 5.5 Special Layer Parameter Features
    • 5.5.1 Skip Deposit
    • 5.5.2 Rate Ramp Trigger of Final Thickness
• Chapter 6 I/O Logic Statement Set-Up
  • 6.1 I/O Logic Statement Overview
  • 6.2 Editing the Logic Statements
    • 6.2.1 Logic Statement Directory
    • 6.2.2 Logic Statement Editing
  • 6.3 ’IF’ Event Definitions
  • 6.4 ’THEN’ Action Definitions
  • 6.5 Logic Statement Example
  • 6.6 I/O Map Directory
  • 6.7 Define User Messages
  • 6.8 Floppy Disk
  • 6.9 Error Messages in I/O Logic Statement Set-Up
• Chapter 7 Remote Communications
  • 7.1 Remote Communication Configuration Overview
  • 7.2 Remote Communication Parameters
  • 7.3 Error Messages in Remote Communications Configuration
  • 7.4 Remote Communications Overview
  • 7.5 Physical Connections
    • 7.5.1 RS-232C Serial Port
    • 7.5.2 IEEE488 Port
      • 7.5.2.1 IEEE Settings for a National Instruments IEEE-GPIB Board
  • 7.6 Message Protocols
    • 7.6.1 INFICON Message Formats
  • 7.7 INFICON Standard Communication Commands
    • 7.7.1 ECHO Command
    • 7.7.2 HELLO Command
    • 7.7.3 Query Commands
      • 7.7.3.1 Query Material Parameters
      • 7.7.3.2 Query Process Parameters
      • 7.7.3.3 Query Utility Parameters
      • 7.7.3.4 Query Sensor Parameters
      • 7.7.3.5 Query Source Parameters
      • 7.7.3.6 Query Output Types
      • 7.7.3.7 Query Logic Statements
      • 7.7.3.8 Query Output Name
      • 7.7.3.9 Query Input Name
      • 7.7.3.10 Query User Messages
    • 7.7.4 UPDATE Commands
      • 7.7.4.1 Update Material Parameters
      • 7.7.4.2 Update Process Parameters
      • 7.7.4.3 Update Utility Parameters
      • 7.7.4.4 Update Sensor Parameters
      • 7.7.4.5 Update Source Parameters
      • 7.7.4.6 Update Output Types
      • 7.7.4.7 Update Logic Statements
      • 7.7.4.8 Update Output Name
      • 7.7.4.9 Update Input Name
      • 7.7.4.10 Update User Message
    • 7.7.5 STATUS Commands
    • 7.7.6 REMOTE Commands
    • 7.7.7 Negative Response Error Codes
  • 7.8 Sample INFICON Messages and Host Programs
    • 7.8.1 Sample INFICON Messages
    • 7.8.2 Sample Host Programs
      • 7.8.2.1 Serial Communications - No Checksum
      • 7.8.2.2 Serial Communication with Checksum
      • 7.8.2.3 IEEE Sample Host Program
• Chapter 8 Source/Sensor Set-Up
  • 8.1 Source/Sensor Set-Up Overview
  • 8.2 Source/Sensor Navigation
  • 8.3 Source Parameters
  • 8.4 Sensor Parameters
  • 8.5 DAC Output Selection Rules
  • 8.6 Error Messages in Source/Sensor Set-Up
• Chapter 9 Utility Set-Up
  • 9.1 Utility Set-Up Overview
  • 9.2 Utility Navigation
  • 9.3 Utility Parameters
  • 9.4 Error Messages in Utility Set-Up
• Chapter 10 Applications
  • 10.1 Multiple Sensor Deposition Control
    • 10.1.1 Instrument Parameters and Corrections for Multiple Sensor Operation
  • 10.2 Trend Analysis
    • 10.2.1 Instrument Parameters Associated with the Trend Analysis Feature
  • 10.3 Use as a System Controller Example
    • 10.3.1 System Equipment List
      • 10.3.1.1 Valves
      • 10.3.1.2 Switches
      • 10.3.1.3 Solenoid Valves
      • 10.3.1.4 Electron Beam Gun Power Supply
      • 10.3.1.5 Vacuum Gauges and Controllers
      • 10.3.1.6 Temperature Sensor
      • 10.3.1.7 Lamps
    • 10.3.2 I/O SetUp
      • 10.3.2.1 Outputs Connected to I/O Board 1
      • 10.3.2.2 Outputs Connected to I/O Board 2
      • 10.3.2.3 Logic Statement Directory
• Chapter 11 Installation and Interfaces
  • 11.1 Location Guidelines
    • 11.1.1 Sensor Types
    • 11.1.2 Sensor Installation
    • 11.1.3 Control Unit Installation
  • 11.2 Avoiding Electrical Interference
    • 11.2.1 Verifying/Establishing Earth Ground
    • 11.2.2 Connections to Earth Ground
    • 11.2.3 Minimizing Noise Pickup From External Cabling
  • 11.3 Connecting the Controller
    • 11.3.1 Verifying the Correct Input Voltage
    • 11.3.2 Voltage Selection
    • 11.3.3 Routing XIU Cables
    • 11.3.4 Interface Cable Fabrication and Pin-Out
      • 11.3.4.1 Source Control Connection
      • 11.3.4.2 Input/Relay Module Connections
      • 11.3.4.3 RS-232C Communications
      • 11.3.4.4 Isolated +24 V(dc) Supply
• Chapter 12 Calibration Procedures
  • 12.1 Importance of Density, Tooling and Zratio
  • 12.2 Determining Density
  • 12.3 Determining Tooling
  • 12.4 Laboratory Determination of Zratio
  • 12.5 Determining Cross Talk Calibration For CoDeposition
    • 12.5.1 Procedure SetUp
      • 12.5.1.1 Cross Talk Calibrate Parameters
        • 12.5.1.1.1 Function Key Selection Choices for Cross Talk Calibration Setup
    • 12.5.2 Cross Talk Calibration MANUAL display
      • 12.5.2.1 Function Key Selection Choices for Cross Talk Calibration Manual
    • 12.5.3 Cross Talk Calibration CALIBRATE display
      • 12.5.3.1 Function Key Selection Choices for Cross Talk Calibration Calibrate
    • 12.5.4 Cross Talk Calibration SELECT display
      • 12.5.4.1 Function Key Selection Choices for Cross Talk Calibration Select
    • 12.5.5 Cross Talk Calibration Procedural Notes
  • 12.6 AutoTuning
    • 12.6.1 AutoTune Parameters
    • 12.6.2 AutoTune Manual Display
    • 12.6.3 AutoTune Tuning Display and AutoTune Description
    • 12.6.4 Definition of AutoTune Messages
    • 12.6.5 AutoTune Preparation Instructions
• Chapter 13 Troubleshooting, Status and Error Messages
  • 13.1 Status and Error Messages
  • 13.2 Troubleshooting Guide
    • 13.2.1 Major Instrument Components and Assemblies
    • 13.2.2 Troubleshooting the Instrument
    • 13.2.3 Troubleshooting Transducers/Sensors
    • 13.2.4 Troubleshooting Computer Communications
  • 13.3 Replacing the Crystal
    • 13.3.1 Standard and Compact
    • 13.3.2 Shuttered and Dual Sensors
    • 13.3.3 Bakeable Sensor
    • 13.3.4 Sputtering Sensor
    • 13.3.5 Crystal Snatcher
    • 13.3.6 CrystalSix
  • 13.4 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2
    • 13.4.1 Diagnostic Procedures
      • 13.4.1.1 Measurement System Diagnostic Procedure
      • 13.4.1.2 Feed-Through Or In-Vacuum Cable Diagnostic Procedure
      • 13.4.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure
      • 13.4.1.4 System Diagnostics Pass But Crystal Fail Message Remains
    • 13.4.2 % XTAL Life
    • 13.4.3 Sensor Cover Connection
      • 13.4.3.1 Compatible Sensor Heads
      • 13.4.3.2 Incompatible Sensor Heads
    • 13.4.4 Specifications
• Appendix A Material Table
  • A.1 Introduction
• Index
  • A
    • abort 10-20
    • acoustic impedance 2-9
    • active oscillator 2-6, 2-8
    • Activity 3-15
    • aerial mass density 2-10
    • aggregate
    • anharmonic 2-2, 2-7, 2-9, 3-36
    • AT
    • Auto Z 3-36, 4-8, 12-1
    • Auto-Control-Tune 2-12, 2-15
    • automatic process control 10-25
    • AutoTune 12-11, 12-15
  • C
    • cable noise 11-7
    • calibration 12-3
    • co-deposition 3-26, 5-6, 12-6
    • comm port 3-17
    • communication
    • configuration
    • configure
    • control
    • controller
    • cross talk calibration 3-19, 12-4
    • crossover pressure 10-17
    • crucible 3-34
    • crystal
    • Customer Service 1-6
    • Customer Support
  • D
    • DAC 8-8, 11-10
    • datalog 3-40
    • dead time 2-11
    • Declaration Of Contamination 1-6
    • density 4-5
    • deposition control
    • deviation 4-8
    • diffusion pump 10-16
    • directory number 4-1
    • DTE 11-13
    • DTR/DSR 7-5
  • E
    • earth ground 1-4, 11-5
    • electrode-to-quartz bond 2-3
    • electromagnetic interference 11-10
    • electron beam gun 10-9, 10-11, 10-23
    • error 3-24
    • evaporation source. 2-11
    • event condition 6-6
  • F
    • fast source 2-11
    • feed ramp 4-12
    • film-induced stress 2-11
    • fit, weighted least-square-exponential 2-12
    • floppy disk 6-19, 9-6
    • foreline valve 10-16
    • Frequency Response Method 2-12
    • fundamental 2-7, 2-8, 2-9, 3-36
  • H
    • high vacuum valve 10-16, 10-18
    • host processing 7-43
    • host/server 7-4
  • I
    • I/O 6-1, 6-16, 10-6, 10-10
    • IAE 2-14
    • idle ramp 4-12
    • IEEE488 7-4, 7-7, 7-42
    • IEEE-GPIB 7-1, 7-8
    • Input/Relay module 11-11
    • integral time 2-13
    • ion gauge emission 10-19
    • ISE 2-14
    • ITAE 2-14, 2-15
  • L
    • Laplace transform 2-12
    • layer 5-1
    • layers
    • lock code 3-40, 9-5
    • logic statement 6-1, 6-15, 10-10
  • M
    • mass sensitivity 2-1
    • material
    • measured deposition rate 2-13
    • measurement sensor 8-1
    • message
    • mode hopping 2-7
    • ModeLock oscillator 2-9
    • multiple layer deposition 12-4
  • O
    • Open Loop Method 2-12
  • P
    • parameter
    • period measurement technique 2-4
    • PID 2-11, 2-13, 2-15, 4-5, 12-11
    • power 2-13
    • precondition 4-10
    • process
    • process definition 3-23
    • program lock code 3-40
    • pulse accumulator 2-4
  • Q
    • quality rate control 2-5
    • quartz crystal 2-1, 2-15
    • quasiharmonic 2-2, 2-9
    • Quick Tune 2-15, 12-11
  • R
    • rate set point 2-13
    • RateWatcher 3-37, 5-6
    • reference oscillator 2-4
    • relay output 10-14
    • remote
    • Repair Service 1-6
    • resonance 2-6
    • roughing valve 10-16
    • RS-232C 7-1, 7-5, 7-41, 11-13
    • RTS/CTS 7-5
  • S
    • Sales and Customer Service 1-6
    • sensor
    • serial communication 11-13
    • series resonance 2-8
    • Service Center 1-6
    • source 4-5
    • spattering 11-4
    • spreadsheet program 3-42
    • spurious shift 2-10
    • status code 7-28
    • switches 10-8
  • T
    • Technical Support 1-6
    • test mode 3-39
    • thickness shear mode 2-2
    • thickness twist mode 2-2
    • tooling 12-2
    • trend analysis 10-4
    • TTL input 10-14
    • Tune 2-15, 12-11
    • turret
  • V
    • vacuum
    • valves 10-8
    • venting 10-19
    • voltage
  • W
    • windup 2-15
    • wire feed 4-12
  • X
    • XIU cable 11-10
  • Z
    • Z-match equation 2-5
    • Z-ratio 2-9, 3-14, 4-5, 12-1, 12-3