Digi NS9750 User Manual
Page 869
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P a c k a g i n g
Product specifications
These tables provide additional information about the NS9750.
ROHS substance
PPM level
Lead
0
Mercury
0
Cadmium
0
Hexavalent Chromium
0
Polybrominated biphenyls
0
Polybrominated diphenyl ethers
0
Table 484: NS9750 ROHS specifications
Component
Weight [mg]
Material
Weight [mg]
Weight [%]
CAS no.
Name
Chip
27.037
7440-21-3
Si
27.0370
0.61
Frame
1841.616
223769-10-6
Epoxy resin
865.5600
19.71
7440-50-8
Cu
736.6500
16.77
7440-02-0
Ni
9.2100
0.21
7440-57-5
Au
1.8400
0.04
Other
228.3560
5.20
Bonding wire
6.990
7440-57-5
Au
6.9900
0.16
Ag paste
3.400
7440-22-4
Ag
2.6200
0.06
Epoxy, other
0.7800
0.02
Epoxy resin
1920.177
60676-86-0
Silica (SiO2)
1747.3570
39.79
Epoxy, other
86.4100
1.97
Phenol Resin
86.4100
1.97
Table 485: NS9750 materials sheet