10a.4 high- density i/o module – Rockwell Automation 8520 9/Series CNC Integration Maintenance Manual Documentation Set User Manual
Page 556
I/O Interface
Section 10A
10A-33
Table 10A.V
Digital I/O Node Address Setting
Node Address
Switch Assembly Position
Hexadecimal
Binary
1
2
3
4
5
6
00
00 0000
OFF
OFF
OFF
OFF
OFF
OFF
01
00 0001
OFF
OFF
OFF
OFF
OFF
ON
02
00 0010
OFF
OFF
OFF
OFF
ON
OFF
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
3D
11 1101
ON
ON
ON
ON
OFF
ON
3E
11 1110
ON
ON
ON
ON
ON
OFF
3F
11 1111
ON
ON
ON
ON
ON
ON
The high--density I/O module provides for an additional 66 inputs and 36
outputs to the system I/O ring.
The high--density I/O module receives input signals from external devices
assigned to its input terminals. These signals are sent to PAL, through the
I/O ring, to be used in the ladder logic process. PAL generates signals that
are then sent through the I/O ring to the high--density I/O module. The
high--density I/O module outputs these signals to external devices assigned
to its output terminals.
This section covers the specifications, connection and the settings of the
high--density I/O module (cat. nos. 8500-HDM).
10A.4
High- density I/O Module