High density i/o module, Figure 2b.25 digital i/o dimensions – Rockwell Automation 8520 9/Series CNC Integration Maintenance Manual Documentation Set User Manual
Page 78
Advertising
![background image](/manuals/580751/78/background.png)
Section 2B
Mounting Dimensions
2B-21
Figure 2B.25
Digital I/O Dimensions
5.5 (0.22) Æ , four places
260
(10.24)
249
(9.80)
11 (0.43)
Optical
connector
OP21
(OUT)
Optical
connector
OP22
(IN)
106
(4.17)
139
(5.47)
150
(5.91)
70
(2.76)
60
(2.36)
11 (0.43)
11083-I
mm
(in.)
The digital I/O module weighs 1.77 kg (3.9 lb)
High Density I/O Module
For more information on connection and configuration of high density I/O
modules refer to page 10A-33.
Figure 2B.26
High Density I/O Module Dimensions for 8500-HDM1
5 (0.20) Æ , four places
342.7
(13.49)
375.4
(14.78)
360.4
(14.189)
32.6 (1.28)
60.45 max
(2.38)
155
(6.102)
170.18
(6.7)
180.98
(7.125)
mm
(in.)
The high density I/O module weighs 1.63 kg (3.61 lb)
Not including cables
Advertising