High density i/o module, Figure 2b.25 digital i/o dimensions – Rockwell Automation 8520 9/Series CNC Integration Maintenance Manual Documentation Set User Manual

Page 78

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Section 2B

Mounting Dimensions

2B-21

Figure 2B.25

Digital I/O Dimensions

5.5 (0.22) Æ , four places

260

(10.24)

249

(9.80)

11 (0.43)

Optical

connector

OP21

(OUT)

Optical

connector

OP22

(IN)

106

(4.17)

139

(5.47)

150

(5.91)

70

(2.76)

60

(2.36)

11 (0.43)

11083-I

mm

(in.)

The digital I/O module weighs 1.77 kg (3.9 lb)

High Density I/O Module

For more information on connection and configuration of high density I/O

modules refer to page 10A-33.

Figure 2B.26

High Density I/O Module Dimensions for 8500-HDM1

5 (0.20) Æ , four places

342.7

(13.49)

375.4

(14.78)

360.4

(14.189)

32.6 (1.28)

60.45 max

(2.38)

155
(6.102)

170.18

(6.7)

180.98

(7.125)

mm

(in.)

The high density I/O module weighs 1.63 kg (3.61 lb)

Not including cables

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